Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroaki Takezawa

Tsutomu Mitani

Takashi Kitae

Yukihiro Ishimaru

Yoshihiro Bessho

Minehiro Itagaki

Kazuo Eda

Tousaku Nishiyama

Norihisa Mino

Yasuhiro Suzuki

Yoshifumi Nakamura

Yasuo Takebe

Tsukasa Shiraishi

Hiroshi Onishi

Hiroto Yanagawa

Tadashi Ootake

Toru Shiino

Masahide Tsukamoto

Satoru Yuhaku

Hideo Hatanaka

Toru Ishida

Nobuhiro Hase

Tetsuo Kawakita

Tadashi Otake

Kazuyoshi Amami

Taketoshi Nakao

Kenichi Nobuta

Yasushi Fukumura

Tsutomi Mitani

Kiyohide Amemiya

The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.

Display device

A display device is provided which is capable of inhibiting a localized elevation in the temperature of a casing thereby uniformalizing the surface temperature distribution over the casing. A display device includes: a display panel having surface arrays of plural pixels for displaying an image by light radiation control on a pixel to pixel basis; an electronic component forming a control circuit configured to perform the light radiation control; a casing housing the display panel and the electronic component therein; and a flat heat-conductive sheet interposed between the display panel and the casing and between the electronic component and the casing.

The present invention provides an organic ultra-thin film firmly fixed to a substrate with the film thickness ranging from tens of nm to hundreds of nm. The organic ultra-thin film comprises polymers fixed on a substrate by M&#x2014;O&#x2014;A&#x2014; bond in which A represents an Si, Ge, Ti, Sn or Zr atom in the polymer, and Mrepresents an atom in the substrate) or by a coordinate bond, the polymers are combined with each other by &#x2014;A&#x2014;O&#x2014;A'&#x2014; bond in which Aand A&#x2032; are Si, Ge, Ti, Sn, Zr or S or by a coordinate bond.

Organic ultra-thin film

A surface of an external electrodeof an electronic partis formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit boardthrough the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrodeas a connecting element. Further, surface roughness (R) of an external electrodeof an electronic part is set to 0.1 &#x3bc;m or more and to 10.0 &#x3bc;m or less and preferably to 1.0 &#x3bc;m or more and to 5.0 &#x3bc;m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesiveon a substrate electrodeof a circuit substrateand also for packaging an electronic element. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.

Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same

Electronic part, an electronic part mounting element and a process for manufacturing such the articles

A conductive adhesive agent of the invention contains an elution preventing film-forming agent , which becomes reactive after electric continuity through a conductive particle appeared in the conductive adhesive agent when a binder resin is being hardened, to thereby form an elution preventing film on a surface of the conductive particle . By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.

Conductive adhesive and connection structure using the same

In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Method for producing mounting structure for an electronic component

A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the parting film. Thus, projection electrodes with a height corresponding to the thickness of the film are formed in a manner such that the projection electrodes are integrated with the via hole conductors.

Method for producing a printed-circuit board having projection electrodes

An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100&deg; C. to 300&deg; C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.

Electronic component mounted member and repair method thereof

The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

Conductive adhesive and packaging structure using the same

A conductive adhesive agent of the invention contains an elution preventing film-forming agent which becomes reactive after electric continuity through a conductive particle appeared in the conductive adhesive agent when a binder resin is being hardened, to thereby form an elution preventing film on a surface of the conductive particle By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Growing community of inventors

Nara, Japan

Hiroaki Takezawa