Matsushita Electric Industrial Co., Ltd.

Hiroaki Takano

Mikiya Nakata

Kenichiro Suetsugu

Yukio Maeda

Shunji Hibino

Masuo Koshi

Yasuji Kawashima

Shoshi Kabashima

Kenichiro Todoroki

Tatsuo Okuji

Flow soldering process and apparatus

A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Connection structure and electronic circuit board

Growing community of inventors

Hirakata, Japan

Hiroaki Takano