Ibiden Company Limited

Hiroaki Satake

Yutaka Iwata

Yogo Kawasaki

Tetsuya Tanabe

A multi-layer printed circuit board including a core substrate, lower interlayer resin insulating layers formed on the surfaces of the core substrate, respectively, through-hole conductors formed in penetrating holes penetrating through the core substrate and the lower interlayer resin insulating layers, conductor circuits formed on the lower interlayer resin insulating layers, respectively, upper interlayer resin insulating layers formed on the conductor circuits and the lower interlayer resin insulating layers, respectively and via hole conductors formed in the upper interlayer resin insulating layers and positioned on the through-hole conductors, respectively.

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

A multi-layer printed circuit board having interlayer resin insulating layers on both sides of a core substrate, respectively, through holes provided to penetrate the core substrate and filled with resin filler, the interlayer resin insulating layers and conductor circuits provided. The resin filler contains an epoxy resin, a curing agent and 10 to 50% of inorganic particles.

Through holesare formed to penetrate a core substrateand lower interlayer resin insulating layers, and via holesare formed right on the through holes, respectively. Due to this, the through holesand the via holesare arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holesand the via holesto be connected to solder bumps(conductive connection pins), respectively, are directly connected to one another, excellent reliability in connection is ensured.

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Ogaki, Japan

Hiroaki Satake