Nippon Steel & Sumitomo Metal Corporation

Nippon Steel Corporation

Toho Titanium Co., Ltd.

Hiroaki Otsuka

Hideki Fujii

Kazuhiro Takahashi

Kenichi Mori

Tomonori Kunieda

Hiroyuki Tanahashi

Yasuhide Ohno

Hisamune Tanaka

Takashi Oda

Tadakatsu Maruyama

Yoshimasa Miyazaki

Osamu Tada

Tomohiro Uno

Mitsuo Ishii

Yoshihiro Fujii

Kiyonori Tokuno

Masashi Konda

Norio Yamamoto

Takashi Domoto

Yasuhiro Suzuki

Tosiharu Kikuchi

Yoshiaki Itami

Mitsuo; Ishii

A titanium alloy material for exhaust system parts excellent in oxidation resistance and cold workability able to be used for an exhaust manifold, exhaust pipe, catalyst device, muffler, or other part characterized by containing, by mass %, Cu: 0.5 to 1.5%, Sn: 0.5 to 1.5%, Si: 0.1% to 0.6%, O: 0.1% or less, and Fe: 0.15% or less, and a balance of Ti and impurities, having a total of the contents of Cu and Sn of 1.4 to 2.7%, and having a total of the volume rates of the &#x3b2;-phases and Ti&#x2014;Cu and Ti&#x2014;Si intermetallic compounds of 1.0% or less.

Heat resistant titanium alloy material for exhaust system part use excellent in oxidation resistance, method of production of heat resistant titanium alloy material for exhaust system part use excellent in oxidation resistance, and exhaust system

The present invention provides a heat resistant titanium alloy sheet excellent in cold workability having high temperature strength characteristics better than JIS Class 2 pure titanium and having a cold workability and high temperature oxidation resistance equal to or better than that of JIS Class 2 pure titanium and a method of production of the same, that is, a heat resistant titanium alloy sheet excellent in cold workability characterized by comprising, by mass %, 0.3 to 1.8% of Cu, 0.18% or less of oxygen, 0.30% or less of Fe, and, as needed, at least one of Sn, Zr, Mo, Nb, and Cr in a total of 0.3 to 1.5%, and the balance of Ti and less than 0.3% of impurity elements and by a &#x3b2;-phase and TiCu-phase being included in a volume percentage of 0 to 2% and, further, a method of production of that titanium alloy sheet characterized by performing the final annealing at 630 to 850&#xb0; C. in temperature range or performing the hot-rolled sheet or coil annealing or intermediate annealing at 630 to 850&#xb0; C. in temperature range and perform the final annealing after cold working at 600 to 630&#xb0; C. in temperature.

Heat resistant titanium alloy sheet excellent in cold workability and a method of production of the same

The present invention provides a titanium slab for hot rolling which can be fed into a general purpose hot-rolling mill for producing strip coil, without passage through a breakdown process such as blooming or a straightening process, and can further suppress surface defect occurrence of the hot-rolled strip coil, and a method of producing and a method of rolling the same, characterized in that in the cast titanium slab an angle &#x3b8; formed by the crystal growth direction (solidification direction) from the surface layer toward the interior and a direction parallel to the slab casting direction (longitudinal direction) is 45 to 90&#xb0;, and moreover, there is a surface layer structure of 10 mm or greater whose &#x3b8; is 70 to 90&#xb0;, and further characterized in that a crystal grain layer of 10 mm or greater is formed whose C-axis direction inclination of a titanium &#x3b1; phase is, as viewed from the side of the slab to be hot rolled, in the range of 35 to 90&#xb0; from the normal direction of the surface to be hot rolled. The titanium slab concerned is produced using an electron beam melting furnace by casting at an extraction rate of 1.0 cm/min or greater.

Titanium slab for hot rolling, and method of producing and method of rolling the same

The present invention provides a titanium sheet covered with a protective film superior in high temperature oxidation resistance and high temperature salt damage resistance and a method of production of the same and an automobile exhaust system using the same. The titanium sheet covered with a protective film is formed on its surface with a protective film of a thickness of 1 to 100 &#x3bc;m where flake-shaped metal Al with an average thickness of 0.1 to 5 &#x3bc;m and average width or average length of 1 to 50 &#x3bc;m or grain-shaped metal Al with an average size of 0.1 to 30 &#x3bc;m is dispersed in 20 to 60 mass % silicone resin or silicone grease and comprised of Si: 15 to 55 mass % and C: 10 to 45 mass % and having a balance of unavoidable impurities. Preferably the titanium sheet of the substrate contains one or both of 0.5 to 2.1 mass % of Cu and 0.4 to 2.5 mass % of Al. The method of production is to brush or spray the above composition of a silicone resin on a titanium sheet to form a protective film and heat it at 150 to 300&#xb0; C. for 5 to 60 minutes.

Titanium sheet covered with protective film superior in high temperature oxidation resistance and high temperature salt damage resistance, automobile exhaust system using same, and methods of production of same

The present invention provides a titanium material for hot rolling which enables reduction of defects on the surface (in the case of a flat material or strip coil, including not only the flat surfaces but also the side surfaces and edges) due to hot rolling. The titanium material for hot rolling has dimples imparted by cold plastic deformation whose mean value of the heights (Wc) of the undulation profile elements is 0.2 to 1.5 mm and mean value of the lengths (WSm) thereof is 3 to 15 mm. The invention also provides a method of producing the titanium material and a method of hot rolling the titanium material.

Titanium material for hot rolling and method of producing the same

A high strength &#x3b1;+&#x3b2;-type titanium alloy, containing, by mass %, 4.4% to less than 5.5% of Al, 1.4% to less than 2.1% of Fe, and 1.5 to less than 5.5% of Mo and including, as impurities, Si suppressed to less than 0.1% and C suppressed to less than 0.01% and a balance of Ti and unavoidable impurities.

High strength &#x3b1;+&#x3b2; type titanuim alloy

A method of connecting a TAB tape to a semiconductor chip is disclosed which comprises the steps of preliminarily locating and fixing bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps. Also disclosed are a bump sheet and a bumped tape to be used in a method of connecting a TAB tape to a semiconductor chip.

Method of connecting TAB tape to semiconductor chip, and bump sheet and

A method of bonding bumps to leads of a TAB tape comprises the steps of preparing a substrate which is provided with through-holes, each having a size which will not allow the bumps to pass therethrough, at positions corresponding to bonding positions of the leads of the TAB tape where the bumps are to be bonded; provisionally arranging the bumps at positions of the through-holes at one side of the substrate by reducing a pressure in another side of the substrate opposite to said one side thereof to such the bumps in said through-holes; disposing the substrate on which the bumps are provisionally arranged and said TAB tape in such a positional relationship that said bumps face to the bonding positions of the leads of said TAB tape; and bonding the provisionally arranged bumps to the leads at the bonding positions and an apparatus for arranging bumps in a positional relationship corresponding to bonding positions of leads of a TAB tape.

Method of bonding bumps to leads of tab tape and an apparatus for

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Tokyo, Japan

Hiroaki Otsuka