Kabushiki Kaisha Toshiba

Toyoda Gosei Co., Ltd.

Toshiba Materials Co., Ltd.

Hiroaki Oshio

Tetsuro Komatsu

Satoshi Shimizu

Teruo Takeuchi

Tatsuo Tonedachi

Kazuhisa Iwashita

Kenji Shimomura

Iwao Matsumoto

Kazuhiro Inoue

Koichi Nitta

Gen Watari

Hidenori Egoshi

Mitsuhiro Nawashiro

Naoya Ushiyama

Hideo Tamura

Shota Shimonishi

Kuniaki Konno

Nozomu Takahashi

Kazuhiro Tamura

Tomokazu Kitajima

Hatsuo Takezawa

Tsutomu Ishii

Akiko Suzuki

Toshiya Uemura

Yasuhiro Shirakawa

Yuji Takahashi

Shinetsu Fujieda

Satoshi Komoto

Koichi Ota

Toshihide Takahashi

Tatsuoki Kono

Kazuaki Ootsuka

Masakata Koseki

Mami Yamamoto

Reiji Ono

Takeshi Miyakawa

Hiroshi Nagasawa

Tsuguo Uchino

Hiroko Tsukamoto

Takeshi Komatsu

Tadashi Umegi

Teruo Takeguchi

Tatsuichiro Maki

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

LED package and method for manufacturing same

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 &#x3bc;m or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

LED package, method for manufacturing LED package, and packing member for LED package

According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

LED package

According to one embodiment, an LED package includes (2&#xd7;n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2&#xd7;n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2&#xd7;n) lead frames and another terminal connected to each of lead frames of the (2&#xd7;n) lead frames other than the n lead frames. The resin body covers the (2&#xd7;n) lead frames and the n LED chips.

According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.

LED package and method for manufacturing the same

According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

LED module

A method for manufacturing a light emitting device includes: measuring at least one of each wavelength of the emitted light of the light emitting element, each optical output of the emitted light of the light emitting element, and each chromaticity of the mixed light emitted through the mixed resin in a manufacturing process of the light emitting device; and adjusting chromaticity for each light emitting device by performing a prescribed chromaticity adjustment with regard to the mixed resin, on basis of a result obtained in the measuring, so that the chromaticity of the mixed light falls within a preset prescribed range.

Light emitting device, and method and apparatus for manufacturing same

A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.

Light emitting device including bleed-out preventing notches

A semiconductor light emitting device includes a semiconductor light emitting element that emits light of a first wavelength, at least two kinds of phosphors that absorb the light of the first wavelength and then emit wavelength-converted light, sealing resin in which the at least two kinds of phosphors are dispersed and the semiconductor light emitting element is embedded, and binder resin. Combined bodies in which the at least two kinds of phosphors are combined by the binder resin are dispersed in the sealing resin.

Semiconductor light emitting device having mixed light emission

A process for producing a light-emitting semiconductor device includes: (i) mixing at least one low-molecular silane or at least one silanol with an alcohol solution containing an alkoxysiloxane to prepare a mixture solution, the amount of the silane or silanol being from 10% by weight to 50% by weight based on the dry weight of an encapsulating material to be formed; (ii) applying the mixture solution to a light-emitting element; (iii) vaporizing the alcohol solvent in the mixture solution applied and drying the residual mixture to thereby form the encapsulating material; and (iv) curing the encapsulating material.

Process for producing light-emitting semiconductor device

A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.

Light emitting device

A light emitting device, free from change of color even when the wavelength of a light emitting element shifts, includes a light emitting element () for emitting primary light having an intensity peak at a wavelength shorter than 400 nm; a silicone resin () provided to embed the light emitting element; and a fluorescent element () contained in the silicone resin to absorb the primary light and release visible light.

A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.

Semiconductor light emitting device

Light emitting diode

Growing community of inventors

Fukuoka-ken, Japan

Hiroaki Oshio