Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hosiden Corporation

Hiroaki Onishi

Toshinori Mimura

Ken Takahashi

Takao Naito

Masahiro Taniguchi

Kensuke Nakanishi

Hiroshi Yamauchi

Masato Hirano

Naoichi Chikahisa

Toshiyuki Murakami

Toshiro Izuchi

Kazuo Ono

Hitoshi Nakahira

Shoji Sato

Sadayuki Nagashima

Akira Kabeshita

Kenichiro Suetsugu

Takaaki Higashida

Wataru Hirai

Koichi Nagai

Nobuya Matsumura

Kazue Okanoue

Toshiaki Yamauchi

Yoshinori Isobata

Masato Mori

Masaru Nonomura

Muneyoshi Fujiwara

Ryuji Awamura

Yoshiyuki Nagai

Kiyoshi Nakanishi

Syoji Sato

Haruto Nagata

Koji Mitsushiro

Jun Shirai

Akihiko Odani

In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone. However, if it is supposed that the microphone is used near one's mouth, each pore has an area of 0.01 mmor less. In addition, to enhance the dust-proof effect, the pores may be subjected to a water-repellent treatment.

Microphone with dust-proof section

An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.

Electro-acoustic transducer

To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.

Mounting substrate and microphone mounted thereon

A circuit board includes a substrate including electrode patterns formed thereon, first chip components mounted on the substrate and a second chip component mounted on a side of electrodes of the first chip components opposite from the substrate. The second chip component is bonded at one electrode to an electrode of the first chip component and is also bonded at the other electrode to an electrode of the first chip component. By stacking chip components in plural stages, it is possible to mount chip components with a high density on the substrate, thereby enabling reduction of the size of the circuit board.

Circuit board and method for mounting chip component

A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.

Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method

A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.

Viscous material application apparatus

A printing screen cleaning apparatus and a method for cleaning a printing screen by employing the cleaning apparatus which includes a cleaning head having a wiping member and a backup member for sucking the paste via a wiping member while sliding the wiping member on a lower surface of the printing screen. The backup member includes a suction port provided in a suction region of a backup surface of the backup member. The backup member also has a groove that extends parallel to the suction region and approximately perpendicular to the sliding direction of the wiping member. The groove partially releases the backup of the wiping member.

Printing screen cleaning method and apparatus

When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Solder paste printing apparatus and printing method

A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings of the mask. Unnecessary solder paste on the surface of the mask is scraped by the scraping squeegee. The solder paste is prevented from being improperly filled in or scraped from the openings even if a speed of the squeegee is increased, so that the solder paste can be printed stably on circuit board.

Apparatus and method for printing solder paste

By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material feeding device with a pressure smaller than the discharge pressure imparted by the discharge-pressure adjusting device.

Method and apparatus for applying viscous material

Screen printing apparatus and screen printing method

A printing method and a printing device are provided, whereby a uniform amount of solder can be coated, printing quality can be improved, variations in adjustment between operators are eliminated, adjustment time is shortened, and productivity can be improved. By keeping the amount of deformation of the end sections of a squeegee constant by maintaining a uniform state of contact between the squeegee and a stencil, there is no occurrence of such problems as unsatisfactory wiping away of a solder paste, which causes the solder paste to be left on the stencil, incomplete filling of the solder paste into the pattern opening, or an increase in the deformation of the end sections of the squeegee, causing solder paste filled into the pattern opening to be scraped away.

Printing method and printing device

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Yamanashi, Japan

Hiroaki Onishi