Hirose Electric Company, Ltd.

Mitsubishi Denki Kabushiki Kaisha

Renesas Technology Corp.

Denka Company Limited

Sony Group Corporation

Icon Corp.

Gatebox Inc.

Hiroaki Nishimura

Takeshi Kishida

Tomoharu Mametani

Yukihiro Nagai

Akinori Kinugasa

Jiro Matsufusa

Shigenori Kido

Yoji Nakata

Toru Arai

Shota Yamamoto

Azusa Yagi

Tomohiro Yamashita

Yukinori Miyake

Michiro Hirai

Takumi Gima

Minori Takechi

A curable composition includes an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying conditions (1) to (4) and an additive resin, which is at least one of a hydrocarbon-based elastomer, polyphenylene ether, olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer, and aromatic polyene-based resin. (1) The number average molecular weight of the copolymer is 5000 to 100000. (2) The aromatic vinyl compound monomer has 8 to 20 carbon atoms, and the content of the unit of the monomer is 0 to 70 mass %. (3) The aromatic polyene is selected from polyenes having 5 to 20 carbon atoms and a plurality of vinyl and/or vinylene groups in the molecule, and the content of the groups is 1.5 to 20 pieces per number average molecular weight. (4) The olefin is selected from olefins having 2 to 20 carbon atoms, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.

Curable composition and cured product thereof

A laminate has an olefin-aromatic vinyl compound-aromatic polyene copolymer and a metal foil. The number average molecular copolymer weight is between 5000 and 100000; the aromatic vinyl compound monomer is aromatic vinyl compound having between 8 and 20 carbon atoms, and the aromatic vinyl compound monomer unit content is between 10 and 60 mass %; the aromatic polyene is selected having between 5 and 20 carbon atoms and vinyl and/or vinylene groups in the molecule, the content derived from the aromatic polyene unit is between 1.5 and 20 pieces per number average molecular weight; and the olefin is selected having between 2 and 20 carbon atoms, being ethylene alone, or having a mass ratio of α-olefin monomer components other than ethylene to an ethylene monomer component contained in the olefin, of 1/7 or less, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.

Copolymer and laminate containing same

The present disclosure relates to an information processing apparatus and information processing method of more easily capturing image in accordance with more various situations. An imaging device including an imaging function unit and an imaging range variable unit is controlled on the basis of vehicle information that is information regarding a vehicle. For example, on the basis of vehicle information obtained in a patrol car, such as vehicle location and position information, vehicle speed information, vehicle operation information, or vehicle attached equipment information, imaging of a subject by the imaging device provided to a flying body and flight by the flying body are controlled. The present disclosure can be applied to, for example, an information processing apparatus, an image processing apparatus, a communication apparatus, an electronic device, an information processing method, or the like.

Information processing apparatus and information processing method

A method for reinforcing a concrete structure so as to have high substrate visibility and sufficient reinforcing performance. A fiber sheet for reinforcing a concrete structure, the sheet including: a framework in which a filament-based, multi-axial mesh sheet and a matrix resin are integrated, wherein the multi-axial mesh sheet has a base weight amount in a range of 500 g/mto 1000 g/m.

Fiber sheet for reinforcing concrete structures

Robot

Digital content player

The device is provided with an inner conductor electrically connected to a counterpart central terminal in a counterpart coaxial device, a tubular outer conductor having the inner conductor disposed in the center thereof, said outer conductor being electrically connected to a counterpart outer conductor in the counterpart coaxial device, a grounding conductor electrically connected to the outer conductor, a resistance element provided in the axial direction between the inner conductor and the grounding conductor, and an annular dielectric member provided between the inner conductor and the outer conductor such that the member has the inner conductor passing therethrough and, at the same time, the inner conductor and the outer conductor are spaced apart from each other in the radial direction.

Termination device

A cable connector is to be connected to a cable and having a fitting surface to be fitted to a mating connector along an axial direction of the cable. The cable connector includes a housing; and contact members secured in the housing. Each contact member includes a basal section extending along the axial direction; a connecting section provided on one side and connected to one end of the cable; a contact section provided on the other side in the axial direction relative to the basal section; and a section to be locked and provided between the basal section and the connecting section along the axial direction. When the contact member is placed in the housing by the sliding movement, a part of each section to be locked on a side opposite the moving destination side in the sliding direction will be locked by a predetermined part of the housing.

Cable connector and connector device having the same

The termination device to connect with the other piece of a coaxial connector in the coaxial connector, which comprises a first component comprised of a terminal to electrically connect with the center conductor of the other piece of the coaxial connector and an outer conductive piece to electrically connect with the outer conductor of the other piece of the coaxial connector, and a second component comprised of a ground conductive piece to electrically connect with the outer conductor of the first component, a relay section to elastically connect with the terminal of the first component at least in the axial direction, and a resistive element that is electrically connected with the ground conductive piece and the relay section and electrically connects between the ground connector and the center conductor of the other piece of the coaxial connector.

In a semiconductor device, an active region is formed in a semiconductor substrate separated by a plurality of isolation regions. A plurality of surface insulating films of different thickness are formed separately on the active region. A plurality of conductive films are formed on the respective insulating films. Then, one of the surface insulating film having smaller thickness is caused to break down to work as an electric fuse.

Semiconductor device having a potential fuse, and method of manufacturing the same

A semiconductor device having a test mark comprising: a semiconductor substrate; a first TEOS layer formed on the semiconductor substrate; a second TEOS layer formed on the first TEOS layer and having a fluidity lower than that of the first TEOS layer at an elevated temperature; a recess formed in the first and second TEOS layers and exposing the surface of the semiconductor substrate, wherein the horizontal cross section of the recess is substantially rectangular in configuration; and a metal layer formed between the first and second TEOS layers and opposing to the corner of the recess.

Semiconductor device having test mark

There is described a semiconductor device having a storage node capacitor structure suitable for rendering memory cells compact, and storage nodes are prevented from tilting. The device includes a storage node which has a vertical surface extending in the direction perpendicular to the surface of a semiconductor substrate, and a dielectric film for tilt prevention purposes which is brought into close contact with the side surface of the vertical surface and which prevents the vertical surface from tilting.

Semiconductor device, and method of manufacturing the same

A directional coupler ( ) comprises main and auxiliary lines ( ) between dielectric boards ( ), a ground plate ( ) provided on the outer face of the dielectric boards ( ), and a conductive case ( ) covering the dielectric boards ( ) and ( ) and making contact with the ground plate ( ).

Directional coupler

A contact structure is formed with no voids in an interlayer insulation film and good surface planarity. A first insulation film ( ) formed of p-TEOS is deposited to cover a substrate ( ) and wires ( ) formed on the substrate ( ). A second insulation film ( ) which is coating glass is formed by SOG. The surface is etched back from the opposite side to the substrate ( ); therefore, the second insulation film ( ) is etched. The etching is stopped at the point where the surface ( ) of the first insulation film ( ) on the wires ( ) is exposed. This ensures good surface,planarity. A third insulation film ( ) is stacked on top of the second insulation film ( ), and portions of the third insulation film ( ) above the wires ( ) are isotropically etched to form openings ( ). At this time, the isotropic etching does not extend over the second insulation film ( ).

Method of manufacturing contact structure

Provided is a method of manufacturing a semiconductor device having a capacitor above a semiconductor substrate, with which it is possible to reduce the number of steps and the cost of manufacture. Specifically, a polysilicon layer (,) in which impurity is diffused is deposited on the entire surface including the inside of a hole (,A). An etching process of the polysilicon layer (,) is performed to form a storage node electrode composed of the polysilicon layer (,) remaining on the bottom and side of a groove for metallization (,) and in the hole (,A). The storage node electrode is broadly divided into a storage node electrode body disposed on the bottom and side of the groove for metallization (,), and a plug part disposed in the hole (,A). The storage node electrode is electrically connected via the plug part to a diffused region (,) of a semiconductor substrate (,).

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Tokyo, Japan

Hiroaki Nishimura