Murata Manufacturing Co., Ltd.

Denso Corporation

Hiroaki Nakamura

Toru Itabashi

Shigeki Nishiyama

Takahiko Furuta

Yuuki Mikami

Ryoichi Shiraishi

Yusuke Takahashi

Naoki Tanimoto

A capacitor module that includes: a plurality of capacitors each including: a first electrode and a second electrode that face each other, and a side surface joining the first electrode and the second electrode, the side surface having a pair of flat portions that face each other, and a pair of curved portions joining the pair of flat portions to each other, the plurality of capacitors being arrayed in a row such that the flat portions of adjacent capacitors face each other; at least one metal sheet arranged in any of spaces between the flat portions of the adjacent capacitors, the at least one metal sheet being in contact with the first electrode of at least one of the adjacent capacitors; a first bus-bar electrically connected to the at least one metal sheet; and a second bus-bar electrically connected to each of the second electrodes of the plurality of capacitors.

Capacitor module having a metal sheet between adjacent capacitors

An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.

Electronic control device including interrupt wire

An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.

An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, and a heat release portion. The interrupt wire melts in accordance with heat generated by an overcurrent. The heat release portion is attached to the common wire and is disposed at a position where a wiring distance from the interrupt wire is shorter than a wiring distance between the interrupt wire and any of the electronic components except for one of the electronic components mounted on the one of the component-mounted wires.

Growing community of inventors

Nagaokakyo, Japan

Hiroaki Nakamura