Fujitsu Ten Limited

Hiroaki Matsuki

Tomohiko Tamaki

Masayoshi Shouno

A high frequency IC package and high frequency unit are simplified and downsized, and the number of manufacturing processes is reduced. The partto determine a characteristic of the high frequency IC chip is arranged outside the sealingof the high frequency IC package. The part can be arranged on the package board, circuit boardor housing chassis. When the part is arranged outside the sealing, the package and the high frequency uniton which the package is mounted can be downsized. In the case of arranging the part on the circuit board, the part can be mounted together with other surface mounting parts. Therefore, the number of manufacturing processes can be reduced.

Growing community of inventors

Kobe, Japan

Hiroaki Matsuki