Konica Minolta, Inc.

Hiroaki Kozai

Akihisa Shimomura

Yoshinori Yoshida

Yusuke Hayashi

Akihisa Yamada

Ayako Suzuki

Masahisa Maeda

Nobuyuki Egami

An inkjet head includes a first and a second channel substrates. At least one of the first and the second channel substrates is formed of silicon. A bonding interface of the first and the second channel substrates is bonded via an adhesive layer. A protective film containing a compound having a Si—C bond is formed on: an ink channel surface formed of silicon among the first and the second channel substrates; and a surface of the channel substrate side formed of silicon in the adhesive layer.

Inkjet head, and method for producing inkjet head

A nozzle plate includes a substrate having thereon at least a base layer and a liquid-repellent layer. A substrate adhesion layer is provided between the substrate and the base layer. A surface portion of the substrate adhesion layer has a higher concentration (atm %) of Cr than a surface portion of the substrate. The base layer is a layer containing at least an inorganic oxide or an oxide containing carbon (C). The liquid-repellent layer is a layer formed by using a coupling agent containing fluorine (F).

Nozzle plate including substrate adhesion layer between base layer and substrate, and inkjet head equipped with said nozzle plate

An inkjet head contains a silicon nozzle substrate having an ink channel surface and an ink ejection surface facing the channel surface, and having a nozzle penetrating from the channel surface to the ejection surface; a channel substrate bonded to the channel surface of the silicon nozzle substrate, and including an ink channel and a substrate body that forms the ink channel; and a liquid-repellent film provided on the ejection surface of the silicon nozzle substrate. The channel substrate includes a through channel that penetrates the substrate body so as to face the nozzle, n-number of individual circulation channels that communicate with the through channel, extend in a direction away from the nozzle, and have a portion overlapping the substrate body in a plan view. A positional relationship between each of the individual circulation channels and the nozzle satisfies a specific Expression 1.

Inkjet head, production method for inkjet head, and inkjet-recording device

Provided is an inkjet head containing a nozzle plate having at least a substrate, wherein the nozzle plate has a liquid-repellent layer on an outermost surface of the substrate on an ink ejection surface side; a liquid-repellent layer base film is provided between the substrate and the liquid-repellent layer; and the liquid-repellent layer base film contains at least silicon (Si) and carbon (C), and having a maximum peak P of a binding energy of a Si2p orbital of a surface portion measured by X-ray photoelectron spectroscopy is in the range represented by the following Formula (1), Formula (1): 99.6 (eV)≤P≤101.9 (eV).

Inkjet head, method of manufacturing inkjet head, and inkjet recording method

There are provided an inkjet head, an inkjet image forming apparatus, a nozzle plate manufacturing method, and an inkjet head manufacturing method capable of improving durability against wiping on an ink discharge surface. The inkjet head includes a nozzle substrate including nozzle holes from which ink is discharged. The nozzle substrate has an irregularity structure formed on an ink discharge surface such that neither ink particles contained in the ink nor a wiping member that wipes the ink discharge surface get caught by the irregularity structure.

Inkjet head, inkjet image forming apparatus, nozzle plate manufacturing method, and inkjet head manufacturing method

An embodiment method for manufacturing a droplet-discharging head substrate may include a first step to perform a surface activation process on joint surfaces of first and second plates with an atom beam, ion beam or plasma; a second step to align and stack the first and second plates in such a manner that nozzle holes formed in the first plate communicate with through-holes formed in the second plate; and a third step to bond the joint surfaces of the stacked first and second plates by atomic bonding without covalent bonding caused by ion movement. The third step bonds the joint surfaces by bringing a load member into contact with the droplet-discharging surface of the first plate at a position away from the nozzle holes to apply pressure under an atmospheric pressure and by bringing the joint surfaces close to each other with an electrostatic attractive force.

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Tachikawa, Japan

Hiroaki Kozai