Iriso Electronics Co., Ltd.

Canon Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Nippon Sheet Glass Company, Limited

Shibaura Mechatronics Corporation

Toyota Jidosha Kabushiki Kaisha

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Hitachi, Ltd.

Fujitsu Corporation

Konica Corporation

Hisamitsu Pharmaceutical Company, Inc.

The Tokyo Electric Power Company, Incorporated

Toshiba Storage Device Corporation

Shin-etsu Co., Ltd.

Hiroaki Kobayashi

Yoshiyuki Ogura

Toyoyuki Teranishi

Daichi Shimba

Hiroaki Yamamoto

Katsumasa Sato

Jun Kawaguchi

Katsuhito Sakurai

Hisashi Ogawa

Hideki Mori

Masahiro Suzuki

Masaaki Furuya

Takumi Ogino

Tomomitsu Saito

Koji Kuniyoshi

Hitoshi Suzuki

Atsushi Furubayashi

Tsutomu Tange

Takashi Sunada

Takashi Doi

Masahiro Kobayashi

Hirofumi Totsuka

Tatsuya Ryoki

Hideaki Ishino

Tsutomu Yamakawa

Katsunori Hirota

Kazutaka Kamitani

Takehiko Okuyama

Kouta Aoki

Nobutoshi Hagiwara

Kazuhiro Doushita

Haruhiko Kakitsu

Shunji Kuramoto

Takahiro Ochi

Satoshi Shiiki

Jun Okazaki

Yuki Ide

Takanori Abe

Shigeaki Sakurazawa

Takanori Watanabe

Hideki Ina

Kazuo Yamazaki

Yusuke Onuki

Fumio Kawamura

Akihiro Shimizu

Taro Kato

Yasushi Shinjo

Nobuyuki Endo

Ichiro Ono

Hiroaki Naruse

Kazuishi Mitani

Jun Hasegawa

Koji Tsuduki

Mitsuo Asai

Hisanori Nakamura

Hideki Ohkita

Shinichi Okada

Naohiro Toda

Nobuaki Kakinuma

Kazuhiro Hatta

Takashi Kokubo

Toshiaki Sukeda

Osamu Matsumoto

Takashi Muromachi

Yasuhiko Shimizu

Hiromichi Watanabe

Hitoshi Uehara

Yuka Takagi

Takehiro Toyoda

Hikaru Maeda

Kosuke Asano

Toru Nakazawa

Masahiro Nishio

Masashi Kusukawa

Kazuo Kokumai

Yasushi Kurihara

Hiroaki Yukutake

Tomoaki Mannami

Hirofumi Suzuki

Junichi Kohno

Yasunori Komukai

Hideki Yamaguchi

Yasumichi Takai

Kazunobu Konda

Akira Oseto

Tatsunori Kato

Ryunosuke Ishii

Kenji Hashimoto

Akira Sasahira

Hidemi Nakai

Yoshinori Hiramatsu

Hirohiko Hisano

Shigeru Mitsuzuka

Hidehiro Shindo

Toshiaki Sugiki

Takashi Yuda

Ken Matsushita

Yoshiaki Maruyama

Yuki Kawahara

Kenichi Kuroiwa

According to one embodiment, a processing liquid supply device includes: a tank that stores the processing liquid; a supply path that supplies the processing liquid to the processing device; a heater that heats the processing liquid; a thermometer that measures a temperature of the processing liquid; a densitometer that measures a concentration of the processing liquid; and a controller including an inspecting unit that inspects the densitometer. The inspecting unit includes: a temperature setting device that sets a boiling point temperature at which a predetermined concentration is reached as a predetermined temperature; a heating controller that heats the processing liquid by the heater so as to reach a target temperature within a predetermined range; and a determination device that determines whether or not the concentration of the processing liquid is a target concentration within a predetermined range based on the predetermined concentration.

Processing liquid supply device, substrate processing apparatus, and method for inspecting processing liquid supply device

According to one embodiment, provided is a supply tank a supply device, and a supply system that stabilizes the liquid temperature of a process liquid to be supplied to a substrate processing device. A supply tank that supplies a process liquid to a substrate processing device includes a container that stores the process liquid, a first dividing plate that divides the container into a first region where the process liquid is introduced, and a second region that supplies the process liquid to the substrate processing device, first piping that feeds, to the second region, the process liquid introduced in the first region, and a first heater which is provided on a path through the first piping, and which heats the process liquid.

Supply tank, supply device and supply system

A supply device includes a collect tank which collects a process liquid from a substrate processing device and heats the collected liquid, and a supply tank connected to the collect tank and which supplies, to the substrate processing device, the process liquid heated in the collect tank. The collect tank includes a collect container that stores the process liquid, a first dividing plate that divides the collect container into a first region where the process liquid is introduced from the substrate processing device, and a second region that introduces the process liquid to the supply tank, piping that feeds, to the second region, the process liquid introduced in the first region, a first heater provided on a path through the piping and which heats the process liquid, and feed piping that feeds, to the supply tank, the process liquid in the second region and heated by the first heater.

Supply device and supply system

According to one embodiment, a processing liquid supply device includes a plurality of tanks, a supply path that supplies a processing liquid to a processing device, a heating unit that heats the processing liquid, a dilution unit that dilutes the processing liquid, a new-liquid supply unit that supplies a new liquid, a common flow path through which the processing liquid of the plurality of tanks passes, a switching unit that switches between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path, a densitometer provided in the common flow path, and a control device that controls at least one of the heating unit, the dilution unit, and the new-liquid supply unit so that the concentration reaches a target value set in advance.

Processing liquid supply device, substrate processing apparatus, and processing liquid supply method

A semiconductor apparatus includes a stack of a first chip having a plurality of pixel circuits arranged in a matrix form and a second chip having a plurality of electric circuit arranged in a matrix form. A wiring path between a semiconductor element configuring the pixel circuit and a semiconductor element configuring the electric circuit or a positional relationship between a semiconductor element configuring the pixel circuit and a semiconductor element configuring the electric circuit is differentiated among the electric circuits.

Semiconductor apparatus and equipment

A transmission system includes: an antenna; a control device including an RF circuit which transmits a first signal for controlling a radio wave to be outputted from the antenna and an external power supply which supplies direct current to the antenna; and a first transmission path which connects the antenna and the control device, and is used in transmission of the first signal and supplying of the direct current to the antenna.

Transmission system, antenna, control device, and transmission method

A first conductive portion includes a first pad surrounded by a first insulator film in a plane perpendicular to a first direction, and a first via connected to the first pad so that the first via is positioned between the first pad and a first semiconductor layer in the first direction. A second conductive portion includes a second pad surrounded by a second insulator film in a plane perpendicular to the first direction, and a second via connected to the second pad so that the second via is positioned between the second pad and a second semiconductor layer in the first direction. The first and the second conductive portions are different in dimension.

Semiconductor apparatus and device

A semiconductor device in which a first chip and a second chip are stacked including a first wiring line and a second wiring line by which the first chip and the second chip are electrically connected. The first wiring line and the second wiring line each include a bonding portion for bonding one of a plurality of conductive patterns placed in the first chip and one of a plurality of conductive patterns placed in the second chip. The number of bonding portions included in the first wiring line is larger than the number of bonding portions included in the second wiring line.

Semiconductor device and method of manufacturing semiconductor device

The present invention provides a rotigotine-containing patch comprising: a backing layer; and an adhesive agent layer, wherein the adhesive agent layer contains rotigotine and/or a pharmaceutically acceptable salt thereof, the adhesive agent layer further contains a styrene-based thermoplastic elastomer, a petroleum-based resin and/or a terpene-based resin, an aliphatic alcohol, and a cross-linked polyvinylpyrrolidone, and in the adhesive agent layer, a mass ratio of a content of the rotigotine and/or the pharmaceutically acceptable salt thereof in terms of rotigotine free form and a content of the cross-linked polyvinylpyrrolidone (content of the rotigotine and/or the pharmaceutically acceptable salt thereof in terms of rotigotine free form:content of the cross-linked polyvinylpyrrolidone) is 10:3 to 1:3.

Rotigotine-containing patch

A method of manufacturing a semiconductor device by using an exposure apparatus having a reticle stage and a projection optical system includes a first period in which substrates are exposed by using a first reticle arranged on the reticle stage, a second period in which substrates are exposed by using a second reticle arranged on the reticle stage, and a third period which is between the first and second periods. The method includes changing, in at least part of the third period, the first reticle arranged on the reticle stage to the second reticle, and performing control, in the first and second periods, to adjust temperature distribution of an optical element of the projection optical system so as to reduce change in aberration of the projection optical system. The third period is shorter than the first period.

Method of manufacturing semiconductor device

An information processing apparatus includes a memory storing instructions and a processor to execute the instructions to perform operations. Four sides of a document included in captured image data are detected. Lengths of the detected four sides of the document are calculated. The operations further include determining which of a plurality of predefined paper sizes corresponds to the document based on the calculated lengths of the four sides. The determined corresponding paper size is set as a document size of the document.

Apparatus, method, and storage medium for processing of an image captured by a camera

A semiconductor apparatus includes a first semiconductor layer, a second semiconductor layer overlapping the first semiconductor layer, and a wiring structure arranged between them. The second semiconductor layer is provided with p-type MIS transistor. A crystal structure of the first semiconductor layer has a first crystal orientation and a second crystal orientation in direction along a principal surface of the first semiconductor layer. A Young's modulus of the first semiconductor layer in a direction along the first crystal orientation is higher than that in a direction along the second crystal orientation. An angle formed by the first crystal orientation and a direction in which a source and a drain of the p-type MIS transistor are arranged is more than 30 degrees and less than 60 degrees, and an angle formed by the second crystal orientation and that direction is 0 degrees or more and 30 degrees or less.

Semiconductor apparatus and device with semiconductor layer having crystal orientations that differ in Young's modulus and relative angle

A photoelectric conversion device comprising: a first substrate that includes a pixel circuit including a photoelectric conversion element; a second substrate having a signal processing circuit that drives the pixel circuit or processes a signal from the pixel circuit; a connection part electrically connecting the first substrate and the second substrate; and an inspection circuit, wherein the inspection circuit is formed in one of the first and second substrates and is connected to a wire supplying a first potential and being provided in the one of the first and second substrates, and the inspection circuit is connected via the connection part to a wire supplying a second potential and being provided in the other of the first and second substrates.

Photoelectric conversion device, method of manufacturing photoelectric conversion device, and method of manufacturing semiconductor device

Growing community of inventors

Kanagawa, Japan

Hiroaki Kobayashi