Toyoda Gosei Co., Ltd.

Hitachi Kyowa Engineering Co., Ltd.

Kyoritsu Elex Co., Ltd.

Hiroaki Kawaguchi

Toshimasa Hayashi

Kenji Mori

Hideaki Takemori

Ryoichi Tohmon

Takumi Narita

Satoshi Higashiyama

Minoru Hirose

Kouji Kudo

Nario Fukumoto

Hiroyuki Fukae

Kengo Nishiyama

Kazuma Mitsuyama

Itsuki Yamamoto

A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base substrate having input/output terminals formed on a front side thereof, and a Si reflector having a sloped through hole and a reflecting film formed at least on a slope defining the through hole. The Si reflector is mounted on the Si base substrate and is fixedly joined to the Si base substrate. The Si reflector and the Si base substrate are joined to each other by a thin film solder.

Submount for light emitting diode and its manufacturing method

In a light emitting diode package or a light emitting diode, a cover body having an opening with a reflecting surface is attached on an upper portion of a base body on which a light emitting diode element is mounted. The base body is formed of alumina ceramics having a pore diameter of 0.10 to 1.25 &#x3bc;m or a porosity of 10% or more, and a thermal via is formed in the base body. Accordingly, it is possible to improve luminance and heat radiating characteristics of the light emitting diode package and the light emitting diode which uses alumina ceramics.

Light emitting diode package including base body with thermal via and light emitting diode using the same

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Haruhi, Japan

Hiroaki Kawaguchi