Kyocera Corporation

Rohm Co., Ltd.

Kyocera Corporaton

Hiroaki Ito

Yoshikazu Fujimori

Takanobu Suzuki

Tomohiro Date

Takanori Ozawa

Takashi Shimizu

Hideaki Sakai

Yohei Sato

Shigeki Kitamura

Katsumi Aoki

Teruhiko Ichimura

A multi-display includes a first display device and a second display device. The first display device includes a first substrate including a first display surface and a first side surface continuous with the first display surface, a first display portion on the first display surface, and a first side wiring extending from the first side surface to the first display surface. The second display device includes a second substrate including a second display surface and a second side surface continuous with the second display surface, a second display portion on the second display surface, and a second side wiring extending from the second side surface to the second display surface. The first side surface and the second side surface are adjacent to and face each other. The first side wiring and the second side wiring are located without facing each other.

Display device and multi-display

A micro-LED board includes a substrate, wiring, a first insulating layer, a micro-LED, and a light-blocking layer. The wiring, the first insulating layer, and the micro-LED are located on the substrate in an order of the wiring, the first insulating layer, and the micro-LED. The micro-LED overlaps the wiring. The light-blocking layer is located between the first insulating layer and the micro-LED, at least partially crosses a portion of the wiring directly below the micro-LED, and has an area that does not overlap a positive electrode and a negative electrode.

Micro-LED board and display device

A pixel circuit includes a first and a second subpixel circuits. The first subpixel circuit includes a first and a second light emitters, and a first setter that sets the first and second light emitters to an emissive or a non-emissive state. The second subpixel circuit includes a third and a fourth light emitters, and a second setter that functions in the same manner as the first setter. The pixel circuit is in at least one of a connection different or an emitter number different state. In the connection different state, a connection between the first and second light emitters is a series or a parallel connection and a connection between the third and fourth light emitters is the other connections. In the emitter number different state, the first and second light emitters are emissive wholly or selectively and the third and fourth light emitter is in the opposite manner.

Pixel circuit, display panel, display device, and composite display device

A display device includes a plate-like substrate having a first surface and a second surface, pixel units on the first surface, and a power supply voltage feeder on the second surface. The power supply voltage feeder outputs first and second power supply voltages applicable to the pixel units. The second power supply voltage is lower in potential than the first power supply voltage. The display device includes a first wiring conductor electrically connecting the power supply voltage feeder and the pixel units and a second wiring conductor electrically connecting the power supply voltage feeder and the pixel units. At least one of the first or second wiring conductor includes a planar conductive portion covering the first surface. The planar conductive portion includes connectors connected to the power supply voltage feeder on at least two sides of the substrate.

Display device

Provided is a semiconductor device that has a low interface resistance between a contact plug and a bottom electrode of a real ferroelectric capacitor. A real capacitor oxidation suppression structure ST including a dummy ferroelectric capacitorand a second plugis formed. The dummy ferroelectric capacitorincludes a second bottom electrode, a second ferroelectric film, and a second top electrode, and is not used as a nonvolatile memory element. The second bottom electrodeis formed on an interlayer insulating film. The second ferroelectric filmis formed on the second bottom electrode. The second top electrodeis formed on the second ferroelectric film. The second plugpenetrates the interlayer insulating filmand electrically connects the second bottom electrodeto a semiconductor substrate

Semiconductor device

A display device includes: a first substrate and a second substrate which are located so that inner main surfaces thereof face each other; a liquid crystal layer located between the first substrate and the second substrate; a seal material located between the first substrate and the second substrate so as to surround the liquid crystal layer, the seal material bonding the first substrate and the second substrate to each other; an organic insulation film located in a seal formation area on the inner main surface of the second substrate, the organic insulation film having an opening section in the seal formation area; and an inorganic insulation film located to continue from an inside of the opening section to a surface of the organic insulation film through an inner wall surface of the opening section, the inorganic insulation film being directly covered with the seal material.

Display device including seal material with improved adhesion strength for bonding two substrates together

A ferroelectric capacitor includes a ferroelectric film, a lower electrode in contact with one surface of the ferroelectric film, and an upper electrode in contact with the other surface of the ferroelectric film. At least one of the upper electrode and the lower electrode has a stacked electrode structure in which one or more oxide conductive layers and one or more metal layers are stacked alternately, and the stacked electrode structure includes at least one of two or more oxide conductive layers and two or more metal layers.

Growing community of inventors

Kyoto, Japan

Hiroaki Ito