Suzuki Motor Corporation

Ulvac, Inc.

F.t.l. Co., Ltd.

Hiroaki Inoue

Mikio Takagi

Michio Ishikawa

Yasushi Higuchi

Seiichi Takahashi

Yutaka Miura

Masayuki Satou

A radical etching apparatus comprising a vacuum chamber for a substrate to be treated; a pipe pathway, connected to the vacuum chamber, a zone for generating plasma and a gas introduction device through which Nand at least one of Hand NHcan be introduced; a microwave applying microwaves to the interior of the pipe pathway; a gas introducer as a source of supply for F, between the vacuum chamber and the zone; and a shower plate. A method comprises introducing Nand at least one of Hand NHinto a pipe pathway and applying microwaves. The gas mixture is decomposed by the plasma forming decomposition products as active species which react with F during transportation to the vacuum chamber to make radicals. An SiOlayer on the substrate etched in the vacuum chamber, by irradiating the substrate with the radicals through the shower plate.

Radical etching apparatus and method

In an internal combustion engine, a valve actuating mechanism actuates an intake valve member to open an intake port, and actuates an exhaust valve member to return a first part of exhaust gas with a high-temperature from a gas exhaust passage into a combustion chamber via an exhaust port. A cooling and recirculation system recirculates a second part of the exhaust gas from the gas exhaust passage into the gas intake passage via a recirculation passage while cooling the second part of the exhaust gas. This results in a stratified temperature distribution of a high-temperature mixture of first fresh air and the first part of the exhaust gas with the high temperature and a low-temperature mixture of second fresh air and the second part of the exhaust gas with a low temperature in the combustion chamber.

Internal combustion engine operable in homogeneous-charge compression mode

There is provided efficient compression auto-ignition combustion over intermediate load range extended towards a low and high load range. An internal combustion engine enables compression auto-ignition combustion by securing a so-called sealed duration created by negative valve overlap. It includes a cylinder head, a cylinder, a piston in the cylinder having a top coupled to the cylinder head, a combustion chamber between an inner surface of a cylinder head and a top of the piston, and intake and exhaust valves. Two intake valves are arranged per each combustion chamber and made to differ in valve lift.

Internal combustion engine

Native oxide film on a semiconductor silicon wafer(s) is dry etched at a temperature of 50&#xb0; C. or less. Hydrogen treatment is then carried out a temperature of 100&#xb0; C. or more to bond the dangling bonds with hydrogen. A jigthat has been used is again used for loading new semiconductor silicon wafer(s). The wafer(s) on the jigis subjected to removal of a native oxide film and then hydrogen bonding. The resultant heat remains in jig and makes it difficult to maintain the wafers to temperature appropriate to removal of a native oxide film. After treatment of hydrogen bonding, inert gas having temperature of from 0 to &#x2212;30&#xb0; C. is injected into reaction vesseland/or treatment preparing vessel, in which a native oxide film has been removed.

Method for surface treating semiconductor

A cylinder injection system for an engine includes an injector for injecting fuel directly into a combustion chamber which is formed in the engine by a cylinder blocks, a cylinder head, and a piston. The system includes a control unit for controlling injection timing of fuel from the injector, and the control unit is configured for dividing the injection timing into several separated subtimes of injection according to the predetermined conditions of the engine.

Growing community of inventors

Shizuoka, Japan

Hiroaki Inoue