Seiko Epson Corporation

Epson Imaging Devices Corporation

Hiroaki Furihata

Hiroyuki Onodera

A mounting structure includes a base member and an electronic component having a protruded electrode which is formed on a transparent substrate. The electrode includes pads and elastic projections that are covered with a conductive film. On the transparent substrate, terminals connected to the conductive film are formed. Dummy projections are provided on the surface of the base member. When mounting the electronic component, the electrodes are deformed by the pressure for the mounting. The dummy projections formed on the base member are also deformed. A pattern, for visually inspecting the deformation volume of dummy projections, is marked on the transparent substrate.

Mount structure, electro-optical device, and electronic apparatus

A mounting structure includes a mounting substrate on which a plurality of mounting pads each constituting a portion of a conductive pattern extending in a Y direction are arranged in an X direction, the X direction and the Y direction being two directions orthogonal to each other, and a member that is mounted on the mounting substrate so as to be electrically connected to the mounting pads. In the mounting structure, a first conductive layer, an insulating layer, a second conductive layer, and a third conductive layer are formed on the mounting substrate in this order from a lower side to an upper side. In addition, each conductive pattern includes the mounting pad that has a three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is an outermost layer, in this order, a test pad that is positioned adjacent to a region where the mounting pad is formed, outside a region where the member is mounted, and that has the three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is the outermost layer, in this order, and a lead portion that extends from the test pad, and that has a two-layered structure of the first conductive layer and the insulating layer, which is an outermost layer.

Mounting structure, electro-optical device, substrate for electro-optical device, and electronic apparatus

A flexible wiring board includes a first single-sided flexible board and a second single-sided flexible board . The first single-sided flexible board includes a first base body having an insulative property, and a first wiring layer formed in a predetermined pattern on the first base body. The second single-sided flexible board includes a second base body having an insulative property, and a second wiring layer formed in a predetermined pattern on the second base body. The first and second single-sided flexible boards respectively have insulating layers and covering the wiring layers and , and the insulating layers are provided with contact sections C and C . The first single-sided flexible board and the second single-sided flexible board are arranged so that the first wiring layer and the second wiring layer face each other, and are bonded through an anisotropically conductive adhesive layer

Growing community of inventors

Matsumoto, Japan

Hiroaki Furihata