Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Hiroaki Fujiwara

Shingo Yoshioka

Yuki Kitai

Tsuyoshi Takeda

Hiromitsu Takashita

Hirosuke Saito

Mikio Sato

Yuko Konno

Yasunori Hoshino

Masashi Koda

Teppei Iwase

Keiko Kashihara

Takayoshi Ozeki

Masashi Yokomori

Masaki Okamoto

Kenichi Sato

Toru Okazaki

Kazunori Takada

Hiroyuki Inoue

Youichi Nakamura

Kazumasa Okumura

Masanori Yasutake

Yasuhiro Okada

Noriyuki Suzuki

Yasuo Fukuhara

Keiji Hanada

Tomoyuki Abe

Koichi Kanematsu

Hidetaka Kakiuchi

Kosuke Tsuda

Masaaki Matsumoto

Yoshimasa Takeda

Takashi Sagara

Daisuke Yokoyama

Tomoaki Iwami

Tatsuo Yonemoto

Tomoaki Watanabe

Mao Yamaguchi

Manabu Kakino

Tomoaki Kuroishi

Masao Imai

One aspect of the present invention is a prepreg including a resin composition or a semi-cured product of the resin composition and a fibrous base material, in which the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, the fibrous base material is quartz glass cloth, the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule, in an amount of 0.01% by mass or more and less than 3% by mass with respect to the prepreg, and a cured product of the prepreg has a dielectric loss tangent of 0.002 or less at 10 GHz.

Prepreg, metal-clad laminate, and wiring board

A metal-clad laminate includes: an insulating layer; and a metal foil being in contact with at least one surface of the insulating layer. The insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25&#xb0; C. and having an average of 1.5 to 3 specific groups per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer. The metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer. The contact surface has a ten-point average roughness Rz of 2 &#x3bc;m or less as a surface roughness.

Metal-clad laminate, metal foil with resin, and wiring board

A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.

A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on at least one principal surface of the insulating layer. The resin composition includes a thermosetting curing agent and a polyphenylene ether copolymer. The polyphenylene ether copolymer has an intrinsic viscosity ranging from 0.03 dl/g to 0.14 dl/g, inclusive. The intrinsic viscosity is measured in methylene chloride at 25&#xb0; C. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by one of formula (1) and formula (2) at an average number of more than or equal to 0.8 and less than 1.5 per one molecule. Further, the metal foil includes a barrier layer containing cobalt on a first surface of the metal foil. The first surface is in contact with the insulating layer, and has a ten-point average roughness (Rz) of less than or equal to 2.0 &#x3bc;m. In formula (1), Rrepresents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and Rrepresents an alkylene group having 1 to 10 carbon atoms. In formula (2), Rrepresents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. 

Metal-clad laminate, printed wiring board and metal foil with resin

A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group.  In Formula (1), n represents 0 to 10, Z represents an arylene group, and Rto Reach independently represent a hydrogen atom or an alkyl group.

Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate

A metal-clad laminate includes: a cured insulating layer including a polyphenylene ether compound; a metal layer joined with the insulating layer; and an intermediate layer interposed between the insulating layer and the metal layer, the intermediate layer including a silane compound. The metal layer has a junction surface that is joined with the insulating layer via the intermediate layer. The junction surface has a ten-point average roughness Rz ranging from 0.5 &#x3bc;m to 4 &#x3bc;m inclusive.

Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board

A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1.

Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board

A modified polyphenylene ether according to one aspect of the invention has an intrinsic viscosity, as measured in 25&#xb0; C. methylene chloride, of from 0.03 to 0.12 dL/g, has on molecular ends thereof an average of 1.5 to 3 groups represented by formula (1) below per molecule, and includes not more than 5 mass % of a high-molecular-weight component having a molecular weight of 13,000 or more. In formula (1), Ris a hydrogen atom or an alkyl group of 1 to 10 carbons, and Ris an alkylene group of 1 to 10 carbons.

Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board

A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.

Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used

A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture.

Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board

A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.

Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used

The invention relates to a resin composition which is characterized by including: a reaction product that includes (A) a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups per molecule and (B) an epoxy compound having an average of 2 to 2.3 epoxy groups per molecule, wherein the reaction product is obtained by pre-reacting at least a part of hydroxyl groups on the polyphenylene ether (A) with epoxy groups on the epoxy compound (B) so that the concentration of terminal hydroxyl groups on the polyphenylene ether (A) becomes 700 &#x3bc;mol/g or less; (C) a cyanate ester compound; and (D) an organometallic salt.

Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board

An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25&#xb0; C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70&#xb0; C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board

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Nara, Japan

Hiroaki Fujiwara