Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Fuji Fiber Glass Co., Ltd.

Hiroaki Doi

Hideo Miura

Ryuichi Saito

Masaaki Hayashi

Yasuo Miyadera

Akio Yasukawa

Tetsuo Kumazawa

Noriyoshi Urushiwara

Kaname Sasaki

Haruki Hamada

Akira Matsushita

Atsushi Fujioka

Kenya Kawano

Tadashi Nagai

In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal member electrically connected to the electronic circuit element, a lead frame extending perpendicular to the thickness direction to face the reverse surface in the thickness direction, and a sealing resin covering at least partially the electronic circuit element, substrate and lead frame while at least a part of the electrically conductive terminal member is prevented from being covered by the sealing resin, the substrate extends to project outward from an end of the lead frame in a transverse direction perpendicular to the thickness direction while the end of the lead frame is covered by the sealing resin.

Electronic circuit device with reduced breaking and cracking

A cooling system for a motor is prevented from exhibiting a thermal fatigue failure due to a temperature cycle. The operation or stopping of the cooling motor fanof the forced cooling system is controlled using the difference between the temperature thereof and the operation start temperature Tis of the power converter. Thus expansion of the temperature range is suppressed.

Cooling system for motor and cooling control method

A resin sealed semiconductor device is provided with an organic resin wiring substrate, an LSI chip having a semiconductor integrated circuit and mounted in a bare chip package form to the organic resin wiring substrate through a plurality of electrical bonding members, and a resin charged into a gap portion between the organic resin wiring substrate and the LSI chip. In this resin sealed semiconductor device, a modulus of longitudinal elasticity of the resin to be charged, its coefficient of linear thermal expansion and its fillet shape are optimized. The resin charged is also preferably colored in black to minimize adverse effects of visible rags on the LSI chip.

Resin sealed semiconductor device having improved arrangement for reducing thermal stress within the device

Composite fibrous products such as composite cloth, composite strings, composite knitted goods, etc., produced by using combination yarns obtained by twisting one or more aromatic polyamide continuous filament yarns and one or more continuous glass yarns have high rigidity and excellent reinforcing effects.

Composite fibrous product

Growing community of inventors

Tokyo, Japan

Hiroaki Doi