Fujitsu Corporation

Hiroaki Date

Hideshi Tokuhira

Hiroki Uchida

Minoru Ishinabe

Makoto Usui

Isao Watanabe

Masanobu Ishiduka

Jun Taniguchi

Yuko Hozumi

Nobuhiro Imaizumi

Tomohisa Yagi

Hitoshi Suzuki

Takashi Nakagawa

Kenji Fukuzono

Takashi Kanda

Kenji Iida

Makoto Sasaki

Wataru Tanaka

Yasutomo Maehara

Kaoru Sugimoto

Seiichi Sugano

Masatomo Asano

Nobuhiro Nanri

Yuko Motoyama

A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Electronic apparatus

A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

Process for producing multilayer board

A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body

Electronic components differing in height (a CPUa capacitorand coil elements) are mounted on a printed circuit boardA heat-absorbing memberis provided above the printed circuit boardin such a way that the membercontacts not only the top surface of the CPUthat is the shortest but the sides of the capacitorand the coil elementsTo circulate a cooling medium, a flow pathis formed in the heat-absorbing memberHeat generated at the CPUis transmitted from its top surface to the cooling medium in the flow pathvia the heat-absorbing memberheat generated at the capacitorand the coil elementsis transmitted from their sides to the cooling medium in the flow pathvia the heat-absorbing member

Heat-absorbing member, cooling device, and electronic apparatus

A cooling structure for electronic equipment is designed for cooling a heat-generating body () disposed inside a case () by recovering heat generated by the heat-generating body () and dissipating the heat to the outside of the case (). The cooling structure includes a heat-receiving section () for recovering heat generated in the heat-generating body (), a thermally insulated space () provided with an air inflow orifice () and an air outflow orifice () and thermally insulated from the heat-generating body () and heat-receiving section () by a thermally insulating member (), a heat-dissipating section () provided inside the thermally insulated space (), a heat transfer member () for transferring the heat recovered in the heat-receiving section () to the heat-dissipating section (), and a fan () for generating forcibly an air flow in the thermally insulated space (). The heat generated by the heat-generating body () is transferred to the heat-dissipating section () via the heat-receiving section () and heat transfer member () and dissipated in a concentrated fashion by using the fan () inside the thermally insulated space ().

Cooling structure for electronic equipment

A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (&mdash;NH&mdash;) having the H replaced by a specific reaction retarder group.

Adhesive composition

A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contacting the metallic particles. Then, an aqueous phase is prepared having a reactive substance B, which is capable of reacting with the reactive substance A, dissolved in water. Thereafter, the oil phase is dispersed in the aqueous phase to form a suspension. In situ reaction of the reactive substances A and B is then caused by applying heat to the suspension or adding a catalyst to the suspension. This forms a coating of a thermosetting insulating resin on the surface of the minute metallic particles. Alternatively, the reactive substance B may not be used. A MC-type conductive filler may also be made by immersing minute metallic particles in an affinity agent, immersing and dispersing the affinity agent treated-particles in an epoxy monomer and polymerizing the monomer to form an insulating polymer on the surface of the minute metallic particles.

Microcapsulating conductive metal particles with polymerized monomers

The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.

Adhesive, bonding method and assembly of mounting substrate

Method for production of microcapsule type conductive filler

Growing community of inventors

Kawasaki, Japan

Hiroaki Date