Georgia Tech Research Corporation

Hiren D Thacker

James D Meindl

Paul Albert Kohl

Thomas K Gaylord

Muhannad S Bakir

Kevin P Martin

Tony Mule′

Oluwafemi O Ogunsola

Optoelectronic probe cards, methods of fabrication, and methods of use, are disclosed. Briefly described, one exemplary embodiment includes an optoelectronic probe card adapted to test an electrical quality and an optical quality of an optoelectronic structure under test having electrical and optical components.

High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use

Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate. The probe substrate is operative to test at least one signal of at least one optoelectronic device under test. The probe substrate is operative to interface with electrical and optical components.

Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication

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Atlanta, GA, United States of America

Hiren D Thacker