Growing community of inventors

Phoenix, AZ, United States of America

Hinmeng Au

Average Co-Inventor Count = 4.50

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 165

Hinmeng AuJohanna M Swan (7 patents)Hinmeng AuAleksandar Aleksov (7 patents)Hinmeng AuSujit Sharan (7 patents)Hinmeng AuHenning Braunisch (7 patents)Hinmeng AuChia-Pin Chiu (7 patents)Hinmeng AuStefanie M Lotz (7 patents)Hinmeng AuEdris M Mohammed (2 patents)Hinmeng AuHinmeng Au (9 patents)Johanna M SwanJohanna M Swan (301 patents)Aleksandar AleksovAleksandar Aleksov (224 patents)Sujit SharanSujit Sharan (198 patents)Henning BraunischHenning Braunisch (118 patents)Chia-Pin ChiuChia-Pin Chiu (116 patents)Stefanie M LotzStefanie M Lotz (19 patents)Edris M MohammedEdris M Mohammed (11 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Intel Corporation (9 from 54,781 patents)


9 patents:

1. 12113026 - Multi-chip package and method of providing die-to-die interconnects in same

2. 11876053 - Multi-chip package and method of providing die-to-die interconnects in same

3. 11824008 - Multi-chip package and method of providing die-to-die interconnects in same

4. 10923429 - Multi-chip package and method of providing die-to-die interconnects in same

5. 10763216 - Multi-chip package and method of providing die-to-die interconnects in same

6. 10510669 - Multi-chip package and method of providing die-to-die interconnects in same

7. 8532449 - Wafer integrated optical sub-modules

8. 8383949 - Method to form lateral pad on edge of wafer

9. 8227904 - Multi-chip package and method of providing die-to-die interconnects in same

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