Systems on Silicon Manufacturing Company Pte. Ltd.

Hing Poh Kuan

The present disclosure relates to a metal comb structure including a first comb which includes a first set of metal fingers each of the metal fingers being connected at one end thereof by a connecting member from which the metal fingers extend. The metal comb structure also includes a second comb which includes a first set of metal fingers inter-digitated with the metal fingers of the first comb, a first set of vias associated with the metal fingers of the second comb and a connecting member connected to the vias thereby connecting the metal fingers of the second comb. The vias extend from the metal fingers of the second comb such that the connecting member of the second comb is located outside a plane defined by the metal fingers of the first and second combs.

Metal comb structures, methods for their fabrication and failure analysis

A method of junction delineation of non-epitaxial wafers comprises the steps of preparing a sample of the wafer, staining the sample using a mixture of between one and three parts hydrofluoric acid to fifty parts nitric acid to twenty parts water, and scanning the sample with a scanning electron microscope.

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Singapore, Singapore

Hing Poh Kuan