Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Hing Leung Marchy Li

Ka Shing Kenny Kwan

Yam Mo Wong

Man Chan

Chi Po Chong

Wing Fai Lam

Kin Yik Hung

Bao Nian Zhai

Ming Wai Kelvin Ng

Boon June Edwin Yeap

A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.

Flanged transducer having improved rigidity

A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.

Transducer assembly for a bonding apparatus

A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the first axis that is larger than the width of the capillary. In particular, the mounting hole is configured such that application of a flexion force to reduce the second width simultaneously expands the first width so as to fit the capillary when the first width is larger than the width of the capillary, and removal of said flexion force contracts the first width whereby to grip the capillary using an elastic force of the horn.

Capillary holder

The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.

Ultrasonic transducer assembly

Growing community of inventors

Singapore, Singapore

Hing Leung Marchy Li