The Hong Kong University of Science and Technology

Asm Technology Singapore Pte Ltd

Hing Leung Li

Yam Mo Wong

Xiang Li

Ka Shing Kwan

Shi Wei Lee

Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

Wire bonder including a transducer, a bond head, and a mounting apparatus

There is described a rotary motor in which a rotor disc is driven by a plate-like driving member comprising a laminate of piezoelectric material sandwiched between outer layers of anisotropic material. When a voltage is applied to the rotor disc the driving member expands into driving contact with the rotor disc and--at the same time--owing to the anisotropy of the outer layers, twists with a torsional movement and this torsional movement imparts a rotary movement to the rotor disc.

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Hong Kong, China

Hing Leung Li