Molecular Imprints, Inc.

Trackingpoint, Inc.

Chatsworth Products, Inc.

Applied Materials, Inc.

Asyst Technologies, Inc.

Hillman Bailey

Mario Johannes Meissl

Daniel Babbs

Sidlgata V Sreenivasan

Michael P C Watts

Byung Jin Choi

Ronald D Voisin

John Hancock Lupher

Norman E Schumaker

Michael Reimers

D Brian Donowho

Jose Arturo Garza, Jr

Joshua James Young

James I Lawrence

Lawrence Randolph Gravell

Daniel Alaniz

Wayne Arnold Zahlit

Byung-Jin Choi

Julian G Blake

James D Strassner

Paul Forderhase

Mark Delz

Roy C Patterson

Matthew Coady

Jason Peter Schauble

Ehren Achee

Kevin D Brase

Dursun Moore

A heater assembly that that is effective at maintaining heating lamps at acceptable temperatures is disclosed. The heater assembly utilizes radiative heat transfer to transfer unwanted heat buildup in the heating lamps to a cooling base. One or more high emissivity films are disposed between the heating lamps and the cooling base to facilitate heat transfer. Further, a reflective coating is applied to a portion of the heating lamps to reflect heat away from the cooling base. The heater assembly may be utilized in a high vacuum environment as it does not rely on convective cooling.

Active cooling of quartz enveloped heaters in vacuum

In certain embodiments, a trigger assembly including a bi-stable switch system configured to selectively engage a portion of the sear in a first state and to transition from the first state to a second state to selectively disengage the portion of the sear in response to an electrical signal.

Trigger assembly of a precision guided firearm

A trigger assembly includes a trigger shoe configured to disengage a sear to release a firing mechanism in response to force applied by a user. The trigger assembly further includes a blocking mechanism configured to selectively prevent the release of the firing mechanism in response to a control signal.

Trigger assembly and system including a blocking mechanism

A trigger assembly includes a plurality of components including a trigger shoe configured to disengage a firing mechanism in response to a force applied by a user. The trigger assembly further includes a first PCB having at least one optical sensor to receive light and a controller configured to determine a positional state of at least one of the trigger shoe and a selected one of the plurality of components in response to the light received by the at least one optical sensor.

Trigger assembly and method of optical detection of a trigger assembly state

A vertical cable manager includes a base, an interconnected double-spine assembly topped by a top frame, and a pair of doors. The double-spine assembly is supported by the base. Each door is removably coupled at each lower corner to the base and at each upper corner to the top frame, thus permitting each door to be opened or hinged along either of its lateral sides or removed entirely. The double-spine assembly may support selectively repositionable mounting members, which may in turn support a large cable spool, a selectively repositionable shelf-mounted handle spool assembly, and various other cable management accessories.

Cable management accessories

The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

Imprint lithography substrate processing tool for modulating shapes of substrates

Chucking system for modulating shapes of substrates

The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.

Disclosed are a method, system and holder for transferring templates during imprint lithography processes. To that end, a method for handling a template, having a patterned mold thereon, in an imprint lithography system having a motion stage with a chucking device coupled thereto, includes providing the template into a template transfer holder. The template transfer holder includes a side coupled to the motion stage and support members extending from the side. The template is disposed within the template transfer holder so as to have the patterned mold facing the side and spaced-apart therefrom. Relative movement is created between the motion stage and an imprint head to place the template transfer holder and the imprint head in superimposition. The template is removed from the template transfer holder, and the template is suspended above the wafer chuck by the imprint head. In another embodiment, a system and a template holder are described that facilitates the method.

Method, system and holder for transferring templates during imprint lithography processes

An aligner is disclosed including a buffer mechanism having a buffer paddle on which wafers may be buffered to increase the throughput of the aligner. The aligner is provided in general to identify a position of a notch, position and read the associated indicial mark and determine the radial runout of the wafer. The aligner includes a rotating support platform in the form of a chuck on which the wafers are received from the robot. A motor rotates the chuck so that the radial runout and notch of the wafer may be identified. According to the present invention, the aligner further includes a buffer mechanism having a buffer paddle and a drive mechanism for vertically translating the buffer paddle. The aligner further includes an analog sensor for determining the notch location, the radial runout and/or the position of the indicial mark on a wafer being rotated on the chuck.

Wafer orienting and reading mechanism

Growing community of inventors

Dripping Springs, TX, United States of America

Hillman Bailey