Shinko Electric Industries Co., Ltd.

Hikaru Tanaka

Takashi Kasuga

Hitoshi Kondo

Tomoyuki Shimodaira

Yasuyoshi Horikawa

Yoshihiro Ihara

Akira Takeuchi

Takashi Sato

Yoshihiro Kita

Naotaka Noguchi

A wiring board includes a pad configured to make an external electrical connection, and an insulating layer. A portion of a lower surface of the pad is covered with the insulating layer. The pad includes a base portion, and an extending portion formed integrally with the base portion and extending toward an outer periphery of a side surface of the base portion in a plan view at a lower end of the side surface of the base portion. The insulating layer is provided with a groove that is located in a periphery of the pad in the plan view, exposes a side surface of the pad, and opens to an upper surface of the insulating layer.

Wiring board

A wiring board includes: a wiring layer; an insulating layer laminated on the wiring layer; an opening portion penetrating through the insulating layer to the wiring layer; a recess portion formed in a surface of the wiring layer exposed from the opening portion of the insulating layer; and a conductor film formed in the opening portion of the insulating layer and the recess portion of the wiring layer, wherein the recess portion of the wiring layer includes a raised portion, which is raised higher than an outer peripheral portion of a bottom surface, at a central portion of the bottom surface.

Wiring board and manufacturing method of wiring board

An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.

Interconnect substrate having groove around pad

A wiring substrate includes: a wiring layer; an insulating layer that is laminated on the wiring layer; an opening portion that passes through the insulating layer to the wiring layer; and an electric conductor film that is formed at the opening portion of the insulating layer. A surface of the insulating layer includes a smoothed portion that is not covered by the electric conductor film, and a roughened portion that includes an inner wall surface of the opening portion covered by the electric conductor film and that have surface roughness that is greater than surface roughness of the smoothed portion.

Wiring substrate and method of manufacturing wiring substrate

A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.

Folded substrate for stacked integrated circuit devices

An interconnect substrate includes a substrate, and a first connection terminal and a second connection terminal that are disposed on a surface of the substrate, wherein the first connection terminal includes a first columnar electrode and a first bump disposed on the first columnar electrode, the first columnar electrode having a flat or convex surface and having a first diameter, wherein the second connection terminal includes a second columnar electrode and a second bump disposed on the second columnar electrode, the second columnar electrode having a concave surface and having a second diameter larger than the first diameter, and wherein a melting point of the first bump and the second bump is lower than a melting point of the first columnar electrode and the second columnar electrode.

Interconnect substrate having columnar electrodes

A wiring substrate includes: a wiring layer; an insulating layer covering the wiring layer, and including a first opening portion exposing the wiring layer and a second opening portion exposing the wiring layer, wherein a diameter of the second opening portion is larger than that of the first opening portion; a first metal layer formed in the first opening portion and the second opening portion, and having a recess in the second opening portion; and a second metal layer that is formed on the first metal layer formed in the first opening portion and the second opening portion, wherein a portion of the second metal layer fills the recess. The first metal layer and the second metal layer serve as connection terminals to be electrically connected to an electronic component.

Growing community of inventors

Nagano, Japan

Hikaru Tanaka