Kabushiki Kaisha Toshiba

Toshiba Chemical Corporation

Tokyo Shibaura Denki Kabushiki Kaisha

Toshiba Chemical Products Co., Ltd.

Hikaru Okunoyama

Masaru Nikaido

Yoshiaki Ouchi

Katsumi Yanagibashi

Kenichi Sato

Kouji Araki

Satoru Yanagida

Tetsunori Niimi

A polymeric acid is synthesized by the ring-opening poly-addition reaction using a biphenyl tetracarboxylic acid as a tetracarboxylic acid moiety and an aromatic diamine, particularly p-phenylene diamine, as a diamine moiety. An aromatic polyimide resin layer possessing a highly desirable heat-resisting property as a heat-resistant insulating coating material and excelling in adhesive strength relative to a substrate is obtained by adjusting the polymeric acid in viscosity with a suitable organic solvent, applying the resultant polyamic acid on a substrate, and firing the applied layer of the polyamic acid. The substrate, for example, is a conductor layer formed as with copper and used as a multi-layer wiring board for hybrid IC's. In a thermal head which is obtained by forming an insulating layer on a metallic substrate and superposing a multiplicity of heat-generating resistors and conductors connected severally to the heat-generating resistors on insulating layer, the aforementioned aromatic polyamide resin layer is formed on the metallic substrate. This aromatic polyimide resin layer as an insulating layer in the thermal head withstands harsh working temperature conditions and adheres strongly to the metallic substrate. Thus, it manifests various outstanding effects.

Heat-resistant insulating coating material and thermal head making use

A semiconductor device comprises a plurality of pellets fixed on a bed by a conductive adhesive agent, an insulating substrate having a junction wiring fixed on the bed between the semiconductor pellets, and wires for connecting the pellets and insulating substrate. The insulating substrate is fixed on the bed by an insulating adhesive agent including filling material such as particles of silicon dioxide and metal particles. The surfaces of the filling material particles are coated with an oxide film.

Semiconductor device mounted upon an insulating adhesive with silicon

A polyamic acid is synthesized by the ring-opening poly-addition reaction using a biphenyl tetracarboxylic acid as a tetracarboxylic acid moiety and an aromatic diamine, particularly p-phenylene diamine, as a diamine moiety. An aromatic polyimide resin layer possessing a highly desirable heat-resisting property as a heat-resistant insulating coating material and excelling in adhesive strength relative to a substrate is obtained by adjusting the polyamic acid in viscosity with a suitable organic solvent, applying the resultant polyamic acid on a substrate, and firing the applied layer of the polyamic acid. The substrate, for example, is a conductor layer formed as with copper and used as a multi-layer wiring board for hybrid IC's. In a thermal head which is obtained by forming an insulating layer on a metallic substrate and superposing a multiplicity of heat-generating resistors and conductors connected severally to the heat-generating resistors on insulating layer, the aforementioned aromatic polyimide resin layer is formed on the metallic substrate. This aromatic polyimide resin layer as an insulating layer in the thermal head withstands harsh working temperature conditions and adheres strongly to the metallic substrate. Thus, it manifests various outstanding effects.

Heat-resistant polyimide insulative coated thermal head

An electric implement having a combination of insulation coverages comprising a thermosetting resin impregnated in an insulation layer wound about the electric implement, and a photohardening resin deposited over the impregnated thermosetting resin. A method of electrically insulating the electric implement, comprising impregnating the insulation layer with a thermosetting resin in vacuum; depositing a photohardening resin on the exposed portion of the thermosetting resin layer; photopolymerizing the photohardening resin; and thermosetting the impregnated thermosetting resin.

Electric implement coated with electrically insulating material and the

Growing community of inventors

Yokohama, Japan

Hikaru Okunoyama