Hitachi, Ltd.

Hikaru Nishijima

Shigeru Kobayashi

Tamotsu Shimizu

Takeshi Oyamada

A conical-frustum-sputtering target for use in a magnetron sputtering apparatus for forming a film on a planar substrate. The sputtering target includes a target member having at least a conical-frustum-shaped surface including a first surface portion parallel to a center portion of the planar substrate and spaced a first distance therefrom, a second surface portion parallel to at least an extension of a peripheral portion of the planar substrate and being spaced a second distance therefrom wherein the second distance is less than the first distance, and at least one-third surface portion inclined with respect to the planar substrate for interconnecting the first surface portion and the second surface portion. By utilizing such a sputtering target, a film having a uniform thickness can be formed on a substrate having side steps and such can be utilized to deposit metallic thin film for a minute wiring pattern and can be applied to a larger substrate.

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Takasaki, Japan

Hikaru Nishijima