Nec Corporation

Japan Aviation Electronics Industry, Limited

Konoshima Chemical Co., Ltd.

Nec Toppan Circuit Solutions, Inc.

Other

Sumitomo Electric Industries, Limited

Nec Electronics Corporation

Tokyo Institute of Technology

Nec C Orporation

Laserfront Technologies, Inc.

Hikaru Kouta

Mikio Oda

Hisaya Takahashi

Hideyuki Ono

Yuzo Shimada

Sakae Kitajo

Yuichi Koreeda

Hideo Kikuchi

Kaichiro Nakano

Jun Sakai

Takashi Ohtsuka

Hideki Yagi

Yoshikazu Suzuki

Junichi Sasaki

Takagimi Yanagitani

Masaki Tsunekane

Katsuji Mukaihara

Shuetsu Kudo

Keiichi Kubota

Nobuaki Takahashi

Katsumi Kikuchi

Shintaro Yamamichi

Naoki Katagiyama

Yasuhiro Sasaki

Yuji Akimoto

Jun Yamazaki

Mitsuaki Tamura

Taras Kushta

Yutaka Urino

Masaki Ohmura

Ichiro Hatakeyama

Taro Kaneko

Mitsuru Yamamoto

Kazunori Miyoshi

Kohroh Kobayashi

Mitsuru Kurihara

Tadahiko Hanada

Chiemi Tanaka

Yuki Furukawa

Arihide Noda

Yoshio Matsumoto

Tomotaka Ishida

Shoko Manako

Kaichirou Nakano

Yuuzou Ikeda

Wataru Ohtsu

Norio Senda

Masaki Tunekane

Toshinori Ishida

Shinichi Tamabayashi

Shinji Nagashiro

Seiji Suda

Ryota Koga

A three-dimensional object formation instruction apparatus receives information pertaining to distribution of a predetermined physical quantity in a three-dimensional space, and on the basis of the received information, determines a shape of a representation body representing the physical quantity, and then, on the basis of the received information, determines a position at which the representation body representing the physical quantity is to be arranged. The three-dimensional object formation instruction apparatus generates a three-dimensional object formation instruction including an instruction to form an object having the determined shape at the determined position, and outputs the generated instruction.

Three-dimensional object formation instruction apparatus, three-dimensional object production method, and program

A multilayer substrate is provided with a conductor plane region in which a plurality of conductor planes are disposed; a clearance region disposed adjacent to the conductor plane region so that the plurality of conductor planes are excluded from the clearance region. A plurality of signal vias are disposed through the clearance region so that the plurality of signal vias are isolated from the plurality of conductor planes. A conductor post is connected to one of the plurality of conductor planes and disposed between two of the signal vias in the clearance region.

Multilayer substrate

In a photoelectric conversion/connection device () including an optical element (), a mounting board () on which the optical element is mounted, and an optical connector () which is connected to the mounting board so as to be optically connected to the optical element, the optical connector () is arranged on a surface () opposite to a mounting surface () of the mounting board () and the optical element () is exposed. The photoelectric conversion/connection device () includes a motherboard () having a main surface () and an electric connector () to be mounted on the main surface of the motherboard. The electric connector () is detachably connected to the mounting board ().

Photoelectric conversion/connection device

A method of producing an optical waveguide connector in which the productivity of a ferrule member can be improved, and the connection loss with a counter connector can be suppressed to a low level is obtained. An optical waveguide connectoris obtained by performing: an aligning step of restricting the position of the tip end of an optical waveguidepassed through an insertion holeof a ferrule member, by a positioning portion of a positioning memberwhich is opposedly placed at the tip end of the ferrule member, thereby aligning the optical waveguideto the ferrule member; and a bonding step of filing a gap between the optical waveguidewhich is passed through the insertion hole, and the insertion hole, with an adhesive agent to fix the optical waveguideto the ferrule member

Ferrule, and method of producing an optical waveguide connector, and optical waveguide connector which use the ferrule

Optical elements (light sourcesor photodetectors) are arranged in a two-dimensional array, and the relative positional relationship between the optical elements and optical waveguidesis defined such that optical waveguidesextend between the optical elements in the two-dimensional array substantially parallel to substratefor increased parallelism. Micromirrorsare disposed in respective optical waveguidesto bend light beams through 90 degrees to realize a highly efficient optical coupling between the optical elements and optical waveguides. The optical waveguides are stacked in multiple stages, and light beams are lead to the optical waveguides in the multiple stacks through micromirrorsacross the stacked plane of the optical waveguides, thereby realizing parallel connection between the two-dimensional array of optical elements and a two-dimensional array of optical waveguides. There is thus provided a connection structure between the optical elements and optical waveguides, which is small in size and high in efficiency, and is of high parallelism.

Connection structure of two-dimensional array optical element and optical circuit

Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules () are arranged on a periphery of an LSI () electrically connected to an electric wiring board (), and liquid cooling mechanisms () are respectively placed on the LSI () and the optical modules (). The plurality of optical modules () may be arranged only on a surface of the electric wiring board () where the LSI () is mounted, only on a surface opposite to the surface where the LSI () is mounted, or on both the same surface as and the opposite surface to the surface where the LSI () is mounted.

Optical interconnection device

An optical connectoris for connecting a connection objectto an optical module. A slideris slidably held by a housingadapted for positioning the connection object and the optical module. The housing has a first positioning portion for receiving the connection object. The slider has a first pressing portionfor elastically pressing the connection object in a first direction toward the first positioning portion and a second pressing portionthat elastically acts in a second direction perpendicular to the first direction.

Optical connector

In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.

Assembly-type durable optical connector adapter

A semiconductor device has an element interconnection, a top-layer element interconnection, a super-connect interconnectionand a bump. The element interconnectionis provided on a semiconductor substratethrough a plurality of insulating layers. The top-layer element interconnectionis formed above the element interconnectionby using a substantially equivalent process equipment. The super-connect interconnectionis provided on the top-layer element interconnectionthrough a super-connect insulating layerhaving a thickness five or more times larger than that of the insulating layer, and has a thickness three or more times larger than that of each the element interconnectionand the top-layer element interconnection. The bumpis formed on the super-connect interconnection. The top-layer element interconnectionhas a signal pad, a power source padand a ground pad. An area of the signal padis smaller than each area of the power source padand the ground pad

Semiconductor device and method of manufacturing semiconductor device

As a composite laser rod capable of satisfying the positional stability and output stability of a laser beam, a laser rod in which a laser active element is doped is intimately inserted into a hollow portion of a non-doped ceramic pipe that has a crystal structure the same as the laser rod followed by baking so as to remove a gap and strain at an interface between the laser rod and the ceramic pipe after the baking further followed by polishing a surface of the ceramic pipe to form a ceramic skin layer, and thereby a composite laser rod is formed. In the composite laser rod, an influence due to fluctuation in the cooling capacity of cooling water or a heat sink is averaged by a non-doped skin layer, temperature fluctuation of the laser rod is suppressed, and an influence of vibration from the cooling water or a cooling fan can be suppressed. When the refractive index of the laser rod is made higher than that of the ceramic pipe, a high efficiency oscillation can be realized, and furthermore when the thermal conductivity of the ceramic pipe is made higher than that of the laser rod, the thermal lens effect can be alleviated.

Composite laser rod, fabricating method thereof, and laser device therewith

An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

Disclosed is a method of forming bump electrodes on wired circuit boards. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is formed on the high-concentration impurity Si template and an opening is formed at the position of the pit. Then, an electric field is applied to the high-concentration impurity Si template and Au is buried in the opening in the plated resist to form a Au-plated buried layer. An electrode pad is formed on a semiconductor chip. With the plated resist separated from the high-concentration impurity Si template, the electrode pad of the semiconductor chip is aligned with the Au-plated buried layer and is bonded by thermo-compression bonding. The Au-plated buried layer is transferred to the electrode pad to form an Au bump on the semiconductor chip.

Method for forming contact bumps for circuit board

Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.

Laser diode module, laser apparatus and laser processing apparatus

There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.

Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk

Growing community of inventors

Tokyo, Japan

Hikaru Kouta