Murata Manufacturing Co., Ltd.

Hijiri Sumii

Junpei Yasuda

Taku Kikuchi

Hisashi Yamazaki

Toshishige Koreeda

Yuji Miwa

Manabu Nakahori

An elastic wave device includes an elastic wave element including a piezoelectric substrate with a first main surface and a second main surface that face each other, an IDT electrode disposed on the second main surface of the piezoelectric substrate, a support disposed on the second main surface of the piezoelectric substrate so as to surround the IDT electrode in plan view, and a cover that is disposed on the support and seals the IDT electrode together with the support and the piezoelectric substrate, a mounting substrate above which the elastic wave element is mounted, and a sealing resin that is disposed on the side of the side of the upper surface of the mounting substrate and seals the elastic wave element. A thickness of the mounting substrate is less than a thickness of the sealing resin that corresponds to a distance from a surface of the sealing resin in contact with the upper surface of the mounting substrate to a surface of the sealing resin on an opposite side of the mounting substrate.

Elastic wave device and method of manufacturing the same

An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.

Elastic wave device, electronic component, and method for manufacturing elastic wave device

An electronic component includes a plurality of electrodes provided in a rectangular or substantially rectangular box-shaped area on an upper surface of a substrate, an electronic component element mounted on the substrate by flip-chip bonding, and an identification mark. The identification mark is provided between a first electrode, which is arranged along one side of the rectangular or substantially rectangular box-shaped area, and a second electrode, which is adjacent to the first electrode along the one side, of the plurality of electrodes provided on the upper surface of the substrate, and is located on or outside a line connecting the outer side edges of the first and second electrodes.

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Nagaokakyo, Japan

Hijiri Sumii