Sony Corporation

Sony Semiconductor Solutions Corporation

Sony Group Corporation

Other

Sony Corpotation

Hiizu Ootorii

Shuichi Oka

Shusaku Yanagawa

Eiji Otani

Kazunao Oniki

Shuzo Sato

Haruo Togashi

Shinji Rokuhara

Kiwamu Adachi

Takeshi Nogami

Hideyuki Suzuki

Naoki Komai

Norihisa Shirota

Katsuji Matsumoto

Masao Ishihara

Zenya Yasuda

Yuji Segawa

Akira Yoshio

Izuho Hatada

Takeshi Kodama

Kazuki Sano

Kazuaki Toba

Masayuki Hattori

Tamotsu Ikeda

Yosuke Ueno

Hiroshi Ozaki

Hiroshi Morita

Toshiyuki Miyauchi

Takahiro Igarashi

Shun Mitarai

Kazukuni Takanohashi

Takeshi Ogura

Takeshi Mizuno

Yoshifumi Miyajima

Kei Satou

Koki Uchino

Sachiya Tanaka

Takaaki Kozuki

Kazunari Saitou

An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

Optical transmission module

A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.

Method of manufacturing mounting substrate and method of manufacturing electronic apparatus

Provided is a connector including: an electric transmitter; an optical transmitter including a lens at an end of an optical transmission path; a housing that is allowed to contain the optical transmitter; and a slide mechanism that attaches the lens to a connected unit at a position exposed from a front surface of the housing.

Connector and electronic apparatus

Provided is an optical head that includes a base substrate and a line head. The line head includes a plurality of sub-line heads electrically independent of one another and arranged on the base substrate in parallel with a first direction. Each of the plurality of sub-line heads includes a circuit substrate unit that constitutes a portion of the base substrate, and an optical-element array that includes a plurality of optical elements each arranged on the circuit substrate unit at least in parallel with a second direction that is a direction of a length of each of the plurality of sub-line heads.

Optical head, optical head scanning device, and method for driving optical head scanning device

An optical waveguide sheet according to the present technology includes a core and a cladding. The core is extending in a first direction and including a maximum diameter portion in a plane parallel to a second direction orthogonal to the first direction and a third direction orthogonal to the second direction is maximum, a minimum diameter portion in the plane parallel to the second direction and the third direction is minimum, and a taper portion in which widths of the core in both directions of the second direction and the third direction gradually change in the first direction between the maximum diameter portion and the minimum diameter portion, the core being provided such that the maximum diameter portion and the minimum diameter portion are alternately arranged in the first direction with the taper portion therebetween. The cladding is provided around the core.

Optical waveguide sheet, optical transmission module, and manufacturing method for an optical waveguide sheet

An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.

Optical connector, electronic apparatus and optical interconnection system

Imaging device including an elongated bendable section, a reinforcing section that is arranged on an end portion of the bendable section in an elongated direction in which the bendable section extends, the reinforcing section having higher rigidity than the bendable section, and an imaging section capable of capturing an image in the elongated direction with respect to the reinforcing section. The bendable section is able to store a power source in at least a part of the bendable section.

Imaging device having an elongated bendable section carries an imaging section to capture an image in a predetermined direction

To provide an optical connector and an optical transmission module that are suitable for a plurality of optical transmission paths two-dimensionally arranged. An optical connector according to the present technology is an optical connector for a plurality of optical transmission paths arranged in a two-dimensional array and includes a first lens, a second lens, a third lens, and a fourth lens. The first lens reflects emitted light from a first optical transmission path of the plurality of optical transmission paths. The second lens reflects emitted light from a second optical transmission path of the plurality of optical transmission paths. The third lens collimates light reflected by the first lens. The fourth lens collimates light reflected by the second lens.

Optical connector and optical transmission module

A photoelectric connector includes a plug and a receptacle. The plug includes a plug housing, a first guide pin, a first signal transmitting/receiving member, a first electrode unit, and a plug housing biasing means. The receptacle includes a receptacle housing, a second signal transmitting/receiving member, a second electrode unit, and a second signal transmitting/receiving member biasing means. In a state in which the plug is fitted to the receptacle, the first electrode unitand the second electrode unitcome into contact with each other and are electrically connected to each other; an opposite surface of the first signal transmitting/receiving memberand an opposite surface of the second signal transmitting/receiving membercome into contact with each other in a state in which the opposite surfaces are not movable relative to each other; the first and second signal transmitting/receiving membersandare biased to a rear side of the plug by the second signal transmitting/receiving member biasing means; and the plug housingis biased in a direction perpendicular to the axis line of the plug by the plug housing biasing meansand the second electrode unit

Photoelectric connector

An image pickup panel () includes: photodetection sections () each including a photodetector (-) and a receiver (-) which are integrally molded and having solder bumps () formed thereon, the photodetector converting received light into a current signal, the receiver converting the current signal into a voltage signal; and a wiring layer () including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections.

Image pickup panel and image pickup processing system

An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system

[Object] To provide an optical waveguide sheet including a mirror structure that can be fabricated at low cost and has a high smoothness, an optical transmission module, and a manufacturing method for an optical waveguide sheet. [Solving Means] An optical waveguide sheet according to the present technology includes a core, a cladding, and a mirror structure. The core extends in a first direction parallel to a first plane. The cladding is provided around the core. The mirror structure has a concave shape which is formed from the cladding to the core, the mirror structure including a first inclined surface that is parallel to a second direction perpendicular to the first direction and parallel to the first plane, is inclined with respect to the first plane, and includes a core region in which the core is exposed, and a bottom surface parallel to the first plane.

A semiconductor laser device that enables flip-chip assembly by having an embedding section around a mesa section, and that has an improved emission lifetime, as well as a photoelectric converter and an optical information processing unit each having such a semiconductor laser device. The semiconductor laser device includes: a mesa section including an active layer, and having a first electrode on a top surface; an embedding section covering the mesa section, and having a first connection aperture that reaches the first electrode; and a first wiring provided on the embedding section overlaying the first connection aperture, the first wiring being electrically connected to the first electrode through the first connection aperture.

Semiconductor laser device, photoelectric converter, and optical information processing unit

Growing community of inventors

Kanagawa, Japan

Hiizu Ootorii