Texas Instruments Corporation

Cisco Technology, Inc.

Hiep Xuan Nguyen

Luigi Colombo

Marie Denison

Rajen Manicon Murugan

Christopher Daniel Manack

Archana Venugopal

Yiqi Tang

Darvin R Edwards

Liang Wan

Vivek Swaminathan Sridharan

Jaimal Mallory Williamson

Yi Yan

Zhemin Zhang

Snehamay Sinha

Joseph Jacques

Arvin Nono Verdeflor

Maurice M Guy

Osvalso Garcia

Osvaldo Garcia

Jaimal Mallory Wiliamson

In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupled to a metal layer in the package; a set of first conductive members vertically aligned with the semiconductor die and exposed to the top surface of the mold compound; and a set of second conductive members coupling at least some of the set of conductive vias to at least some of the set of first conductive members. The set of second conductive members is exposed to the top surface of the mold compound.

Enhanced mold compound thermal conductivity

An electronic device includes a multilevel package substrate, a die, a lid, and a package structure that encloses the die, a portion of the lid, and a portion of the multilevel package substrate, where the package structure fills a gap between a side of another portion of the lid and a side of the die. A method includes attaching a die to a multilevel package substrate with a first side of the die facing the multilevel package substrate and a second side facing away from the multilevel package substrate; positioning a lid on the multilevel package substrate with a first portion of the lid spaced apart from the second side of the die; and forming a package structure that encloses the die and a portion of the multilevel package substrate and fills a gap between the first portion of the lid and the second side of the die.

Embedded lid for low cost and improved thermal performance

A system in a package (SIP) includes carrier layer regions that have a dielectric material with a metal post therethrough, where adjacent carrier layer regions define a gap. A driver IC die is positioned in the gap having nodes connected to bond pads exposed by openings in a top side of a first passivation layer, with the bond pads facing up. A dielectric layer is on the first passivation layer and carrier layer region that includes filled through vias coupled to the bond pads and to the metal post. A light blocking layer is on sidewalls and a bottom of the substrate. A first device includes a light emitter that has first bondable features. The light blocking layer can block at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.

Integrated system-in-package with radiation shielding

In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.

Power module with enhanced heat dissipation

An integrated circuit ('IC') package mold includes an upper mold platen that defines an upper mold cavity for receiving an upper substrate having a die attach side with a plurality of dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the upper substrate faces upwardly. A lower mold platen defines a lower mold cavity for receiving a lower substrate having a die attach side with a plurality dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the lower substrate faces downwardly.

Integrated circuit package mold assembly

A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-&#xb0; K, and an electrical resistivity less than 100 micro-ohm-centimeters.

Integration of backside heat spreader for thermal management

Techniques for cooling electronics assemblies are provided. A divider, such as an electronic card, is utilized to define flow channels through the chassis of the electronics assembly. The divider is parallel to the electronic cards and air movers, such as fans, can be utilized in a push-pull configuration to cause air to flow and counter-flow through the flow channels to cool the electronic cards.

High efficiency counter-flow shelf cooling system

A high efficiency multi-directional airflow system for a telecommunications equipment assembly used for housing electronic apparatuses which facilitate telecommunications functionality. The equipment assembly defines an internal cavity which can be divided into a plurality of air flow channels. Each of the plurality of air flow channels captures a sub-portion of the overall volume provided by the internal cavity. The smaller volume flow channels provide a smaller cross-sectional area through which the majority of air travels. Since the cross-sectional area is smaller, the velocity of the air through the flow channels is increased. Since the air velocity is increased, the heat transfer coefficient is also increased, thus allowing for the more efficient removal of heat from the electronic apparatuses. A set of fan trays can include a plurality of fans each directionally positioned to work in series to cause air to flow through the plurality of flow channels.

Growing community of inventors

Grand Prairie, TX, United States of America

Hiep Xuan Nguyen