Applied Materials, Inc.

International Business Machines Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Apple Inc.

Hienminh Huu Le

Akihiro Hosokawa

Tzong-Shii Pan

Makoto Inagawa

Bradley Owen Stimson

John M White

Cheng Kai Chen

Jrjyan Jerry Chen

Ta-Chang Fu

Khadijeh Bayat

Avery P Yuen

Isaac Wing-Tak Chan

Rasmi R Das

Victor Wing Chung Shum

Transparent conductors including a silver layer with high transparency and low sheet resistance are described. In some examples, the silver layer can be located between two transparent conductive oxide layers. The transparent conductor can further include additional transparent conductive oxide layers, optical layers, and/or additional conductive layers (e.g., layers including ITO or another fully or partially transparent conductive material), for example. In some examples, transparent conductors including a silver layer can be included in a touch screen device. For example, one or more shielding layers or one or more touch electrodes can include transparent conductors with a silver layer. In some examples, the silver layer can improve transparency, sheet resistance, and/or infrared reflection characteristics of the transparent conductor.

Touch screen with transparent electrode structure

The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.

Cooled PVD shield

A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target having a first surface and a second surface, and a bonding layer disposed between the backing plate and the second surface. The first surface of the target is in fluid contact with a processing region and the second surface of the target is oriented toward the backing plate. The target assembly may include multiple targets.

PVD target

Embodiments of an apparatus and method of monitoring and controlling a large area substrate processing chamber are provided. Multiple types of metrology tools can be installed in the substrate processing system to measure film properties after substrate processing in a processing chamber. Several number of a particular type of metrology tools can also be installed in the substrate processing system to measure film properties after substrate processing in a processing chamber. The metrology tools can be installed in a metrology chamber, a process chamber, a transfer chamber, or a loadlock.

Integrated metrology tools for monitoring and controlling large area substrate processing chambers

Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bonding at least one sputtering target tile to a backing plate comprises providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate, and providing at least one metal mesh within the elastomeric adhesive layer, wherein at least a portion of the at least one metal mesh contacts both the at least one sputtering target tile and the backing plate, and the at least a portion of the at least one metal mesh is made of metal wire with diameter greater than 0.5 mm.

Elastomer bonding of large area sputtering target

A method for making a film stack containing one or more metal-containing layers and a substrate processing system for forming the film stack on a substrate are provided. The substrate processing system includes at least one transfer chamber coupled to at least one load lock chamber, at least one first physical vapor deposition (PVD) chamber configured to deposit a first material layer on a substrate, and at least one second PVD chamber for in-situ deposition of a second material layer over the first material layer within the same substrate processing system without breaking the vacuum or taking the substrate out of the substrate processing system to prevent surface contamination, oxidation, etc. The substrate processing system is configured to provide high throughput and compact footprint for in-situ sputtering of different material layers in designated PVD chambers.

Integrated PVD system using designated PVD chambers

An integrated gimbal suspension includes a flexure with an integrated, built-in gimbal, and includes a limiter structure that constrains motions of the gimbal in multi-degrees of freedom. The limiter structure includes one or more tab-shaped limiters and corresponding stops integrally formed into the gimbal assembly at strategic locations, which interact to provide the desired constraints to the motions of the flexure gimbal to prevent permanent damage from over-straining the gimbal or flexure beyond its designed range. The limiters may be pre-formed tab-shaped structures that are bent from the plane of the flexure. As the gimbal moves from its nominal position, one or more limiters engage the stops before such motion reaches the limit of the designed range of motion of the gimbal.

Motion limiter for disk drive integrated gimbal suspension

An integrated suspension for a hard disk drive is formed as a single-piece flat assembly. The design eliminates the need for mechanical reinforcement such as flange forming, and requires no additional weld processing to form the functional portion of the assembly. A partial etch process is used to reduce local thicknesses in the gimbal and hinge areas to reduce the overall stiffness of the suspension. The proximal end structure of the suspension is also built by partial etching to achieve higher natural frequencies. The suspension design also incorporates built-in load/unload features and two-sided, opposite-facing limiters to limit excessive slider displacement during the manufacturing process, loading/unloading, and non-operational shock environments.

High performance suspension with reduced flow-induced vibration

A suspension design for improving the curing process for head bonding application and a method for same is disclosed. Vias are formed in the load beam and the flexure so that UV light is allowed to pass to cure the UV sensitive adhesive thereby bonding the slider to the head gimbal assembly.

Suspension design for improving the curing process for head bonding application and method for same

A hard disk drive has actuator arms with a load beam or suspension extending from one end. Each suspension carries an integrated lead layer with electrical traces which are connected to a magnetic read/write heads for interacting with magnetic disks in the disk drive. Each suspension also has a pair of polymer pads on each side of the traces. Each pad has a series of bumps which give the pads a greater thickness than the lead layer for preventing contact between the traces, suspensions and magnetic disks during shock vibration. The pads also prevent contact between the trace conductors and the head separator during the separation process.

Growing community of inventors

San Jose, CA, United States of America

Hienminh Huu Le