International Business Machines Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Global Technologies Netherlands B.v.

Hien Phu Dang

Sri Muthuthamby Sri-Jayantha

Arun Sharma

Vijayeshwar Das Khanna

Isao Yoneda

Evangelos Stavros Eleftheriou

Mark Alfred Lantz

Charalampos Pozidis

Gerard McVicker

Naoyuki Kagami

Tetsuo Ueda

Kiyoshi Satoh

Timothy Joseph Chainer

Muthuthamby Sri-Jayantha

Yuzo Nakagawa

Akira Tokizono

Mark Delorman Schultz

Gareth Geoffrey Hougham

Pritish Ranjan Parida

Lawrence Shungwei Mok

Sung Kwon Kang

Kenji Okada

Hideki Ohzeki

Tatsuo Nakamoto

Satoshi Yamamoto

S M Sri-Jayantha

Kiochi Takeuchi

Nayouki Kagami

Gordon James Smith

Hiroyuki Suzuki

Vinod Kamath

Hideo Asano

Suresh Kumar

Nobuyuki Kitazaki

Tatsuya Sakai

Jung H Yoon

Mirei Hosono

Masayuki Takeuchi

Mitsuro Ohta

Tatsuya Endoh

Hirouki Suzuki

Akira Shinjoh

Yoshiyasu Nakamoto

Takahiro Nakagawa

Vijaveshwar Das Khanna

An organic substrate that has one or more layers. Each of the layers is made of one or more sub-patterns of conductive material disposed on a non-conductive material. The layers are divided into one or more tile subareas. A corresponding layer pair has a corresponding upper layer (with corresponding upper tile subareas) and a corresponding lower layer (with corresponding lower tile subareas) that are equidistant from and symmetric about a reference plane. Each corresponding upper tile subarea and the corresponding lower tile subarea are in a same vertical projection. A symmetric upper (lower) layout on the corresponding upper (lower) tile subarea replaces an original corresponding upper (lower) layer. The symmetric upper and lower layouts have one or more upper portions that have no electrical function but are partly responsible for making the symmetric lower layout and symmetric upper layout more thermo-mechanically symmetric and help reduce warp.

Warp mitigation using pattern-matched metal layers in organic substrates

A server node connection system uses two or more proximity sensors per server node to determine progressive, real time changes in wipe length for each individual connector on the node that is connected to an opposing header connector on header connected to a midplane of the server assembly/rack. The system is capable of scanning, monitoring, trending, and alarming.

Server node connector mating condition health monitoring and reporting

An organic substrate and method of making with optimal thermal warp characteristics is disclosed. The organic substrate has one or more top layers and one or more bottom layers. A chip footprint region is a surface region on each of the top and bottom layers that is defined as the projection of one or more semiconductor chips (chips) on the surface of each of the top and bottom layers. One or more top removal patterns are located on and may or may not remove material from the surface of one or more of the top layers within the chip footprint region of the respective top layer. One or more bottom removal patterns are located on and remove material from the surface of one or more of the bottom layers outside the chip footprint region of the respective bottom layer. The removal of the material from one or more of the top layers and/or bottom layers changes and optimizes a thermal warp of the organic substrate. In some embodiments, a Shape Inversion Temperature (SIT) of the substrate is made equal to or above a reflow temperature.

Optimum warp in organic substrates

This invention is a laminated structure and methods used for electrically connecting one or more semiconductor chips to various external electrical connections where stresses within the laminated structure due to thermal cycle are reduced by adding conductive material to selected subareas of upper and lower layers in the structure such that the volume of conductive material in corresponding subareas is equal in amount and orientation within a threshold. This reduces differential stresses between the layers as temperature changes and accordingly reduces failures of materials and/or connections in the structure during manufacturing and operation.

Controlling warp in semiconductor laminated substrates with conductive material layout and orientation

Server node connnector mating condition health monitoring and reporting

Aspects relate to methods, systems, and computer program products for estimating future levels of solar power received at a sensor including receiving, by a processor, a first measured power value at a first time from the sensor, calculating a first value of a dynamic correction factor based on the first measured power value associated with the first time, applying the first value of the calculated dynamic correction factor to a power estimation model, generating a first power estimation value for a second time using the power estimation model, wherein the second time is later than the first time, receiving a second measured power value at the second time, and calculating a second value of a dynamic correction factor based on the second measured power value associated with the second time and the first value of the dynamic correction factor.

Real-time estimation of solar irradiation

A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.

Data center cooling method

A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

Data center cooling system

A method for characterizing thermomechanical properties of an organic substrate is provided. The method includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the plurality of circuit layers of the substrate; selecting a given one of the plurality of circuit layers for processing; converting the image to a two-dimensional finite element model (FEM) image of the given one of the circuit layers; determining at least one of a coefficient of thermal expansion (CTE), modulus and Poisson's ratio of the FEM image of the given one of the circuit layers; repeating the steps of selecting a given one of the plurality of circuit layers, converting the image to a two-dimensional FEM image, and determining at least one of a CTE, modulus and Poisson's ratio of the FEM image for all of the plurality of circuit layers corresponding to at least a portion of the organic substrate; and constructing a three-dimensional representation of at least a portion of the organic substrate including the plurality of circuit layers as a function of at least one of the CTE, modulus and Poisson's ratio of each of the plurality of circuit layers.

Characterizing thermomechanical properties of an organic substrate using finite element analysis

A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip.

Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit

A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.

Method to extract and apply circuit features in organic substrate for automation of warp modeling

A method of estimating temperature of a transient nature of a thermal system, including, without a temperature measurement being made available, determining a drive current and thermal parameters of the thermal system.

A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.

Characterizing thermomechanical properties of an organic substrate using three-dimensional finite element analysis

A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

Packaging substrate having pattern-matched metal layers

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Nanuet, NY, United States of America

Hien Phu Dang