Intel Corporation

Senju Metal Industry Co., Ltd.

Sumitomo Metal (smi) Electronics Devices, Inc.

Hideyuki Yoshino

Mitsuo Zen

Tetsuya Yamamoto

Sanae Taniguchi

Roy Bell

Takenori Azuma

Rusli Othman

Akihiro Hidaka

A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn&#x2014;Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Solder coated lid

A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the peripheral side of a ceramic plate. The solder layer has a portion of an increased solder thickness and a portion of a reduced solder thickness extending along the peripheral direction. When sealing the semiconductor package, a gas confined within the inside of the semiconductor chip mounting site of the package substrate may be discharged from the semiconductor package for realizing hermetic sealing.

Lid with variable solder layer for sealing semiconductor package,

Growing community of inventors

Ube, Japan

Hideyuki Yoshino