Tokyo Electron Limited

Hideyuki Yamamoto

Yuji Kamikawa

Takayuki Toshima

Kazuhiro Takeshita

Hiroaki Inadomi

Koukichi Hiroshiro

Koji Egashira

Hiroshi Komiya

An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object.

Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method

The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each other; and a pair of processing-liquid supply mechanisms provided respectively corresponding to the pair of side walls. The pair of processing-liquid supply mechanisms are respectively configured for supplying the processing liquid toward a central portion of the processing tank in the width direction connecting the pair of side walls, thereby to create a rising flow of the processing liquid in a central area in the width direction of the processing tank. Each inner wall face of the pair of side walls includes a main body, a projecting portion located above the main body, and a discharge guide portion located uppermost and providing a discharge port configured for allowing the processing liquid to overflow. The discharge guide portion is inclined upward, opposite to the central portion in the width direction. The projecting portion includes an inner end portion located nearer to the central portion in the width direction, as compared with the main body and discharge guide portion.

Substrate processing apparatus

Growing community of inventors

Koshi, Japan

Hideyuki Yamamoto