Nitto-denko Corporation

Hideyuki Usui

Kazumasa Igarashi

Amane Mochizuki

Ryuusuke Naitou

Ichiro Suehiro

Megumu Nagasawa

Satoshi Okuda

Minoru Nakao

Satoshi Tanigawa

Hisataka Ito

Yasuhito Funada

Toshihiko Omote

Takahisa Konishi

Yuuji Saiki

Kouji Akazawa

Nobuhiko Yoshio

Masanori Ueno

Seiji Umemoto

Takashi Oda

Yusuke Shimizu

Hiroyuki Katayama

Kazunori Mune

Kazuhiro Ikemura

Yoshinari Takayama

Tsutomu Nishioka

Satoshi Ito

Daisuke Kitagawa

Tadao Okawa

Michio Komoto

Takemichi Yoshida

Haruo Tabata

Hideto Kimura

The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet ()) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m&#xb7;K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

LED mounting substrate

The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which Rand Reach independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R's are the same or different and a plurality of R's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

Microlens array

The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.

Resin sheet for encapsulating optical semiconductor element and optical semiconductor device

A polarizer of the invention comprises a polyvinyl alcohol-based film which is at least dyed with at least iodine and uniaxially stretched, having a single transmittance of 43% or more, a polarizing efficiency of 99.9% or more, and a dichroic ratio of 30 or more, wherein the dichroic ratio is calculated from a parallel transmittance (Tp) and a crossed transmittance (Tc) at a wavelength of 440 nm, and have good hue.

Polarizer, method for producing same, polarizing plate, optical film, and image display

The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer sheet that comprises a releasable substrate and a metal foil formed thereon; forming a core layer on the undercladding layer; forming an overcladding layer so as to cover the core layer and the undercladding layer; stripping the releasable substrate from the metal foil; and etching the metal foil to thereby form a predetermined conductor pattern.

Process for producing electro-optic hybrid circuit board

The present invention provides a process for producing an optical waveguide, comprising the steps of: continuously applying a fluorene derivative layer onto a continuous substrate and curing the layer to thereby form a lower cladding layer; continuously applying a photosensitive fluorene derivative layer onto the lower cladding layer; continuously exposing the applied photosensitive fluorene derivative layer to a light through a photomask having a predetermined pattern; continuously subjecting the exposed photosensitive fluorene derivative layer to post-exposure heating; continuously developing the heated photosensitive fluorene derivative layer to remove the unexposed areas therein, thereby forming into the predetermined pattern; curing the developed photosensitive fluorene derivative layer to thereby form a core layer having the predetermined pattern on the lower cladding layer; and continuously applying a fluorene derivative layer over the lower cladding layer so as to cover the core layer and curing the fluorene derivative layer to thereby form an upper cladding layer.

Process for producing optical waveguide

The present invention provides a process for producing an optical waveguide which comprises: disposing on an undercladding layer at least one member for forming an optical-path deflection plane; forming a photosensitive resin layer over the undercladding layer so as to at least partly cover the member for forming an optical-path deflection plane; subjecting the photosensitive resin layer to exposure and then development to thereby form at least one core layer; and forming an overcladding layer over the undercladding layer so as to cover the at least one core layer.

The invention provides an electro-optic hybrid circuit board having an optical waveguide superposed on a wiring circuit board, the electro-optic hybrid circuit board comprising: an insulating layer; a conductor pattern formed on the insulating layer; an undercladding layer formed on the conductor pattern-having insulating layer so as to surround the conductor pattern; a core layer formed on the undercladding layer; and an overcladding layer formed to cover the core layer and the undercladding layer.

Electro-optic hybrid circuit board

A polarizer used for an image display such as a liquid crystal display, a plasma display, and an electroluminescence display, and the polarizer suppresses coloring of transmitted light. The polarizer includes a polymer film having a difference of 10% or less between the maximum and the minimum of a first transmittance in a wavelength ranging from 400 nm to 700 nm.

Polarizer, polarizing plate, liquid crystal display, and image display, and a method for producing the polarizer

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &#x3bc;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &#x3bc;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &#x3bc;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil

There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.

Circuit-forming substrate and circuit substrate

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant

A semiconductor device in which the space between a semiconductor chip and an auxiliary wiring plate is sealed with resin. The auxiliary wiring plate has insulating layers and on both sides of the routing conductor, the insulating layer on the side of the semiconductor chip has a hole being led from the routing conductor to the electrode of the semiconductor chip, the metal filled in the hole and the metal bump formed so as to protrude from the hole serves as an inner electrode. The semiconductor device can be manufactured by the TAB technique.

Growing community of inventors

Osaka, Japan

Hideyuki Usui