Daicel Chemical Industries, Ltd.

Daicel Corporation

Dakel Chemical Industries Ltd

Tokyo Ohka Kogyo Co., Ltd.

Hideyuki Takai

Dai Shiota

Hiroto Miyake

Kunihiro Noda

Yasuyuki Akai

Hiroto Tanigawa

Mayumi Kuroko

Yoshinori Tadokoro

Kyuhei Kitao

Hiroyuki Hirakawa

Katsuya Maruo

Hisashi Maeshima

Atsushi Sato

Kenji Oka

Michihiro Sugahara

Hiroyuki c/o Daicel Chemical Industries Ltd Hirakawa

Provided are: a novel triepoxy compound capable of forming, through polymerization, a cured article having excellent heat resistance; a production method thereof; a curable composition including the triepoxy compound; and a cured article obtained by curing the curable composition. The triepoxy compound according to the present invention is represented by Formula (1). The triepoxy compound represented by Formula (1) may be obtained typically by oxidizing a compound represented by Formula (2) with an oxidizing agent. In Formulae (1) and (2), Rto R&#xb0; are the same as or different from one another and each represent hydrogen atom, methyl group, or ethyl group. Formulae (1) and (2) are expressed as follows: 

Triepoxy compound and method for producing same

Disclosed is a method for producing a cyclic olefin compound having two or more cyclohexene rings per molecule via intramolecular dehydration of an alicyclic alcohol having two or more hydroxylated cyclohexane rings per molecule. The method includes the step (i) of heating the alicyclic alcohol at a temperature of 130&#xb0; C. to 230&#xb0; C. and a pressure greater than 20 Torr in an organic solvent in the presence of a dehydration catalyst, to carry out dehydration of the alicyclic alcohol while distilling off by-product water, which dehydration catalyst is liquid or soluble in a liquid reaction mixture under the reaction conditions; and the subsequent step (ii) of heating the resulting reaction mixture at a temperature of 50&#xb0; C. to 220&#xb0; C. and a pressure of 200 Torr or less to recover the cyclic olefin compound as a distillate. According to the method, side reactions such as isomerization are suppressed, and high-purity cyclic olefin compounds with less impurities can be simply and efficiently obtained in high yields.

Method for producing cyclic olefin compound

A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Composition containing cycloaliphatic epoxide, polyol oligomer, and curing catalyst

Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3',4&#x2032;-diepoxybicyclohexyl compound represented by following Formula (1): wherein R1 to R18 each represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or a substituted or unsubstituted alkoxy group, in which the alicyclic diepoxy compound contains isomers of the 3,4,3&#x2032;,4&#x2032;-diepoxybicyclohexyl compound in a content of less than 20% based on the total of the 3,4,3&#x2032;,4&#x2032;-diepoxybicyclohexyl compound and the isomers thereof in terms of peak area ratio as determined by gas chromatography.

Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom

Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator

A liquid epoxy resin composition of an epoxy resin, a curing agent, and a curing accelerator, where the epoxy resin is an alicyclic epoxy compound present in an amount from 100 to 30% by weight. The alicyclic epoxy compound is preferably produced by using a percarboxylic acid having a water content of 2% by weight. The curing agent is preferably a liquid acid anhydride.

Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator

An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic percarboxylic acid. The curable epoxy resin composition has high reactivity for various curing agents, low viscosity, and excellent workability. A cured product thereof shows useful physical properties for uses in coatings, inks, adhesives, sealants, and encapsulants, etc. It is of extremely high quality as an epoxy resin composition for the encapsulation of electronic parts. A stabilizer for an electrical insulating oil (the alicyclic diepoxy compound or an electrical insulting oil containing the compound) is low in acid value, and the stabilizer improves the properties of the insulating oil. A cured product obtained by curing a casting epoxy resin composition for electrical insulation has excellent properties such as high bending strength, high Tg, and low permittivity.

Curable alicyclic diepoxy resin composition

A high-purity cycloaliphatic diepoxy compound of General Formula (II) is an epoxidized product of a cycloaliphatic diolefinic compound of General Formula (I) having an isomer content as detected in gas chromatography (GC) of 15% or less: wherein X represents a bivalent group selected from the group consisting of, for example, O, S, &#x2014;SO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, and &#x2014;C(CH)&#x2014;; and Rto Rmay be the same as or different from each other and each represent hydrogen atom, a halogen atom, a hydrocarbon group which may contain oxygen atom or a halogen atom, or an alkoxy group which may be substituted. Such a high-purity cycloaliphatic diepoxy compound is prepared by producing the cycloaliphatic diolefinic compound through distillation, epoxidizing the compound with an aliphatic percarboxylic acid containing substantially no water, carrying out desolvation, and further purifying the epoxidized compound through distillation.

High-purity cycloaliphatic diepoxy compound and preparation process thereof

There are provided a curable resin composition composed of an epoxy compound having an ionic polymerizability and viscosity of not more than 1,000 cP at 25&#xb0; C., an acrylic resin having an ionic polymerizable functional group, and a thermally-activating ionic polymerization catalyst which can be dissolved by heating and crystallized by cooling, a method for the preparation thereof, and a coated article using the curable resin composition. The curable resin composition is excellent in storage stability, and a cured coating layer therefrom is excellent in heat resistance, staining resistance, removability of staining substances, or scratch resistance, and an electrical insulating property, and in which dependence of volume resistivity upon temperatures is small, and from which an excellent coated article is obtained, and it is widely utilized in industry.

Curable resin composition, a method for the preparation thereof, and a coated article thereof

A process for preparing an epoxidized organic polymer by dispersing or suspending a solid organic polymer in an organic solvent and epoxidizing the dispersed or suspended polymer with a peroxide. The epoxidized polymer thus obtained is usable for coating materials, resin modifiers, rubber modifiers or adhesives, thus being extremely useful. The epoxidized organic polymer is useful to prepare a thermoplastic resin composition having improved mechanical strength, and comprising a thermoplastic resin, an epoxidized EPDM and an acid anhydride. The thermoplastic composition can be used to prepare a primer composition including a 100 parts by weight of an epoxidized EPDM and 50 to 70 parts by weight of a product of chlorination of a polyolefin modified with an unsaturated carboxylic acid or an anhydride thereof. An unvulcanized rubber composition can be prepared for the epoxidized EPDM, a diene polymer and a vulcanizing agent, and the unvulcanized rubber composition can be used in a process for producing rubber moldings by extruding the unvulcanized rubber composition and vulcanizing the extrudate.

Process for producing epoxidized organic polymer, thermoplastic resin composition, primer composition, unvulcanized rubber composition, rubber moldings, and process for producing the moldings

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Ohtake, Japan

Hideyuki Takai