Kabushiki Kaisha Toshiba

Hideyuki Tabata

Takayuki Tsukamoto

Hiroshi Kanno

Takamasa Okawa

Atsushi Yoshida

Hirofumi Inoue

Yoichi Minemura

Eiji Ito

Hiroyuki Nagashima

Masanori Komura

Kenichi Murooka

Shigeki Kobayashi

Jun Hirota

A semiconductor memory device according to an embodiment described below comprises: first lines arranged in a first direction perpendicular to a main surface of a substrate and extending in a second direction crossing the first direction; second lines arranged in the second direction, extending in the first direction, and intersecting the first lines; memory cells disposed at intersections of the first lines and the second lines; and an interlayer insulating film provided between the second lines. The interlayer insulating film has an air gap extending continuously in the first direction so as to intersect at least some of the first lines aligned along the first direction. The interlayer insulating film also includes an insulating film positioned above the air gap and having a curved surface that protrudes toward a direction of the substrate.

Semiconductor memory device

This semiconductor memory device comprises a memory cell array that includes: a plurality of first lines; a plurality of second lines intersecting the plurality of first lines; a plurality of memory cells each disposed at an intersection of the plurality of first lines and the plurality of second lines and including a variable resistance element; and a select transistor respectively connected to an end of the plurality of first lines. The select transistor includes a gate electrode, a gate insulating film, and a conductive layer. Moreover, one end of that conductive layer is connected to the end of the first line, and a non-linear resistance layer configured from a non-linear material is connected between the first line and the conductive layer.

A semiconductor memory device comprises: first lines disposed in a first direction perpendicular to a substrate and extending in a second direction parallel to the substrate; second lines disposed in the second direction and configured to extend in the first direction, the second lines intersecting the first lines; and memory cells disposed at intersections of the first lines and the second lines and each including a variable resistance element. Furthermore, a third line extends in a third direction orthogonal to the first and second directions. A select transistor is connected between the second and third lines. A control circuit controls a voltage applied to the first and third lines, and the select transistor. The control circuit renders conductive at least one of the select transistors and thereby detect a current flowing in the third line, and determines a deterioration state of the select transistor according to a detection result.

Semiconductor memory device and control method thereof

According to an embodiment, a non-volatile memory device includes a first wiring extending in a first direction, a second wiring extending in a second direction orthogonal to the first direction. The device includes third wirings, and a first and a second memory. The third wirings extend in a third direction crossing the first direction and orthogonal to the second direction, and aligned in the second direction on both sides of the second wiring. The first memory is provided between one of third wiring pair and the second wiring, the pair of third wirings facing each other across the second wiring. The second memory is provided between another one of the third wiring pair and the second wiring. The second wiring has a block portion between a first portion in contact with the first memory and a second portion in contact with the second memory.

Resistance change type memory device with three-dimensional structure

A semiconductor memory device according to an embodiment includes a memory cell array and a control circuit. The memory cell array includes first lines and second lines intersecting each other, a third line commonly connecting to the first lines, memory cells disposed at intersections of the first lines and the second lines, respectively. The control circuit is configured to execute a state determining operation detecting a voltage of the third line, and adjust a voltage applied to the first lines and the second lines during a resetting operation or a setting operation based on a result of the state determining operation. The resetting operation raises a resistance value of the variable resistance element. The setting operation lowers the resistance value of the variable resistance element.

Semiconductor memory device and memory system

A nonvolatile semiconductor memory device comprises: a memory cell array including first interconnections, second interconnections intersecting the first interconnections, and memory cells having a variable resistance element and being provided at respective intersections of the first interconnections and the second interconnections, the memory cell array being divided into bays including a predetermined number of the memory cells; and a control circuit configured to execute a first write step and a second write step executed after the first write step at a data writing operation, wherein the control circuit is configured to change over the number of simultaneously selected bits and/or the number of simultaneously selected bays depending upon whether a write step is the first write step or the second write step.

Nonvolatile semiconductor memory device changing the number of selected bits and/or the number of selected bays at data write operation

A cell array includes a memory cell region in which memory cells are formed and a peripheral region that is provided around the memory cell region. In the memory cell region, first lines are extended in parallel with a first direction, and the first lines are repeatedly formed at first intervals in a second direction orthogonal to the first direction. In the peripheral region, each of the first lines located at (4n&#x2212;3)-th (n is a positive integer) and (4n&#x2212;2)-th positions in the second direction from a predetermined position has a contact connecting portion on one end side in the first direction of the first line. In the peripheral region, each of the first lines located at (4n&#x2212;1)-th and 4n-th positions in the second direction from the predetermined position has the contact connecting portion on the other end side in the first direction of the first line. The contact connecting portion is formed so as to contact a contact plug extended in a laminating direction.

Nonvolatile semiconductor memory device and producing method thereof

A non-volatile semiconductor memory according to an embodiment includes: a data storage unit including a memory cell array and a writing circuit; an encoder that directs the writing circuit to write write data to the memory cell array; a writing determining circuit that determines whether the writing of the write data to the memory cell array within a predetermined number of writing operations fails or succeeds, inverts the write data to generate new write data when the writing of the write data fails, and directs the writing circuit to write the new write data to the memory cell array; a switching circuit that inverts read data which is read from the memory cell to generate new read data when the writing determining circuit determines that the writing of the write data fails; and a decoder that decodes the read data into the information data.

Non-volatile semiconductor memory and data processing method in non-volatile semiconductor memory

A nonvolatile semiconductor memory device comprises a semiconductor substrate; a cell array block formed on the semiconductor substrate and including plural stacked cell array layers each with a plurality of first lines, a plurality of second lines crossing the plurality of first lines, and memory cells connected at intersections of the first and second lines between both lines; and a plurality of via-holes extending in the stacked direction of the cell array layers to individually connect the first or second line in the each cell array layer to the semiconductor substrate. The via-holes are formed continuously through the plural cell array layers, and multiple via-holes having equal lower end positions and upper end positions are connected to the first or second lines in different cell array layers.

Nonvolatile semiconductor memory device including a via-hole with a narrowing cross-section and method of manufacturing the same

A nonvolatile semiconductor memory device comprises a semiconductor substrate; a cell array block formed on the semiconductor substrate and including plural stacked cell array layers each with a plurality of first lines, a plurality of second lines crossing the plurality of first lines, and memory cells connected at intersections of the first and second lines between both lines; and a plurality of via-holes extending in the stacked direction of the cell array layers to individually connect the first or second line in the each cell array layer to the semiconductor substrate. The via-holes are formed continuously through the plural cell array layers, and multiple via-holes having equal lower end positions and upper end positions are connected to the first or second lines indifferent cell array layers.

Nonvolatile semiconductor memory device including via-holes continuously formed through plural cell array layers

The memory cell is located at respective intersections between the first wirings and the second wirings. Each of the memory cells has a rectifier element and a variable resistance element connected in series. The rectifier element includes a p type first semiconductor region, and a n type second semiconductor region. The first semiconductor region is formed of, at least in part, silicon-germanium mixture (SiGe(0&#x3c;x&#x3c;=1)). The second semiconductor region is formed of silicon (Si).

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Yokkaichi, Japan

Hideyuki Tabata