Nec Corporation

Hideyuki Satou

Katsumi Kikuchi

Suguru Watanabe

Takanori Nishi

Akira Miyata

Kenji Nanba

Ayami Yamaguchi

Yoshihito Hashimoto

Tomohiro Yamaji

Tsuyoshi Yamamoto

Ryota Yuge

Aiko Uchiyama

Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip () is flip-chip mounted on an interposer () by a bump (). A coplanar line () coupling adjacent quantum bits is formed on the quantum chip (). A gap () is provided, in the interposer (), at a location facing a center conductor () of the coplanar line (). A second ground electrode () is formed around gap (). The interposer () has a connection electrode () connecting the second ground electrode () around the gap (). A bump (A) formed in the vicinity of the connection electrode () is connected to the first ground electrode () and the second ground electrode ().

Quantum device and quantum computer

Provided are an oscillator and a quantum computer capable of suppressing an occupied area of a circuit. An oscillator () includes a resonator () including a plurality of loop circuits in which a first superconducting line (), a first Josephson junction (), a second superconducting line (), and a second Josephson junction () are annularly connected, and a magnetic field application circuit () including an electrode that goes around in a predetermined shape and configured to apply a magnetic field to the loop circuit, in which the electrode is arranged so as to face at least two of the loop circuits.

Oscillator and quantum computer

A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip, an interposeron which the quantum chipis mounted, and a socketdisposed so as to be opposed to the interposer, the socketcomprising a movable pinand a housingsupporting the movable pin, in which at least one end of the movable pin, which includes the one end and the other end opposite to the one end, is movable relative to the housing, the one end being in electrical contact with a terminal of the interposer, and the other end is in an electrical contact with a terminal of a boardon which a connectoris formed, the connectorbeing configured to serve as an external input/output.

Quantum device

A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip, and an interposeron which the quantum chipis mounted, in which the interposerincludes a conductive wiring line CLelectrically connected to the quantum chip, and a metal filmdisposed in a part of the interposerthat is in contact with a sample stagehaving a cooling function, and a mounting surfaceof the interposeron which the quantum chipis mounted or an opposite surfaceopposite to the mounting surfaceincludes a first area ARand a second area ARdifferent from the first area ARas viewed in a direction perpendicular to the mounting surfaceor the opposite surface

Quantum device having quantum chip on interposer in contact with sample stage

A quantum device includes a quantum chip and a holder. The holder includes a pedestal, a recess portion formed in a main surface of the pedestal so as to be opposed to the quantum chip, and a suction tube provided such that in the recess portion, a suction opening is positioned in a bottom surface of the quantum chip.

Holder, quantum device, and manufacturing method of quantum device

An object of the present invention is to provide a member and a method for producing a fibrous carbon nanohorn aggregate with high efficiency. According to an embodiment of the present invention, there is provided a carbon nanohorn aggregate production member for producing a fibrous carbon nanohorn aggregate in which single-walled carbon nanohorns are aggregated radially and are connected in a fibrous form, comprising: a target fixing jig having a target housing section on an upper surface which has a partition and is capable of mounting a plurality of rod-shaped catalyst-containing carbon targets without making a mutual contact, and a jig guide for movement on a side surface; a jig for target fixing jig movement which is slidably engaged with the jig guide for movement; and a target fixing jig guide which is inclined downward, and is equipped with a guide rail which is adapted to an arrangement of the plurality of rod-shaped catalyst-containing carbon targets, wherein the target fixing jig is slidably engaged with the guide rail, and moves in a downward direction by a weight thereof and in a transverse direction along the guide rail by the jig for target fixing jig movement.

Member for continuous production of carbon nanobrush, and method for continuous production of carbon nanobrush

A quantum device () includes: an interposer (); a quantum chip (); a first connection part () that is provided between the interposer () and the quantum chip () and electrically connects a wiring layer of the interposer () to a wiring layer of the quantum chip (); and a second connection part () that is provided on a main surface of the interposer () where the first connection part () is arranged and is connected to a cooling plate ().

Quantum device and method of manufacturing the same

A quantum device according to an example embodiment includes a quantum chip, and an interposeron which the quantum chipis mounted, in which the interposerincludes a conductive wiring line CLelectrically connected to the quantum chip, a mounting surfaceof the interposeron which the quantum chipis mounted or an opposite surfaceopposite to the mounting surfaceincludes a first area ARand a second area ARdifferent from the first area ARas viewed in a direction perpendicular to the mounting surfaceor the opposite surface, the conductive wiring line CLis disposed in the first area ARon the mounting surfaceor the opposite surface, and a movable memberis in contact with the second area ARof the interposer

A quantum device () includes an interposer (), a quantum chip () mounted on the interposer (), and a shield part () provided so as to surround a quantum circuit region of the interposer () and the quantum chip (). Accordingly, the quantum device () is able to prevent interference in the quantum circuit region due to exogenous noise.

Quantum device including shield part and method of manufacturing the same

A quantum device () includes: an interposer (); a quantum chip (); and a connection part () that is provided between the interposer () and the quantum chip () and electrically connects a wiring layer of the interposer () to a wiring layer of the quantum chip (), in which the connection part () includes: a plurality of pillars () arranged on a main surface of the interposer (); and a metal film () provided on a surface of the plurality of pillars () in such a way that it contacts the wiring layer of the quantum chip () and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars () becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars ().

Growing community of inventors

Tokyo, Japan

Hideyuki Satou