Hitachi Metals, Ltd.

Hitachi Cable, Inc.

Proterial, Ltd.

Hideyuki Sagawa

Hiromitsu Kuroda

Takahiro Sugiyama

Toru Sumi

Kazufumi Suenaga

Seigi Aoyama

Keisuke Fujito

Hiroshi Ishikawa

Detian Huang

Kazuma Kuroki

Takayuki Tsuji

Yuju Endo

Kotaro Tanaka

Masashi Moriyama

Yoshinori Tsukamoto

Takahiro Sato

Hideaki Takehara

Hideki Nonen

Masashi Arai

Masayoshi Goto

Takumi Sato

Yuichi Oda

Hidenori Abe

Xinweilong Li

Hiroaki Numata

Takahiko Hanada

Tosiyuki Horikoshi

Humio Horii

Tetsuya Tokumitu

Nobuhito Sakuyama

Shigeru Okamoto

A signal transmission cable is provided with a conductor, an insulator covering around the conductor, a shield layer covering around the insulator, a sheath covering around the shield layer, and a plating base layer is provided between the insulator and the shield layer to cover around the insulator. The shield layer has a plating layer provided to cover the plating base layer to be in contact with an outer peripheral surface of the plating base layer. A surface roughness of an outer peripheral surface of the plating layer is less than a surface roughness of an inner peripheral surface of the plating layer.

Signal transmission cable

A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer includes a non-cross-linked polyethylene is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an entire periphery of a roughened outer surface of the crack suppressing layer. The crack suppressing layer is unadhered to the insulator. The plating layer is adhered to the crack suppressing layer. The crack suppressing layer suppresses an occurrence of a cracking in the plating layer by bending together with the plating layer while being integral and moving with the plating layer in a longitudinal direction of the cable.

High frequency signal transmission cable

A signal transmission cable includes a signal line, an insulation layer covering the signal line, and a shield layer covering the insulation layer. A first oxygen amount Aon an outer peripheral surface of the insulation layer is 1.2 times or greater than a second oxygen amount Ainside the insulation layer, or a contact angle on the outer peripheral surface the insulation layer is 130&#xb0; or less, or an adhesion-wetting surface energy on the outer peripheral surface the insulation layer is 27 mJ/mor greater, or a first amount of a hydroxy group on the outer peripheral surface of the insulation layer is greater than a second amount of a hydroxy group inside the insulation layer.

A linear shape member is composed of a linear shape electrical insulating body made of a fluoropolymer resin and including a plurality of crack shape grooves on a surface thereof, and a plating layer coating the surface of the electrical insulating body. The surface of the electrical insulating body meets at least either one of two conditions: that the surface of the electrical insulating body is not lower than 40 nm in arithmetic mean roughness Ra; and that the surface of the electrical insulating body is not lower than 80 nm in root mean square roughness Rms.

Linear shape member and producing method therefor

A cable is composed of a linear shape conductor, a first electrical insulating member coating a periphery of the conductor, a shield made of a plating layer coating a surface of the first electrical insulating member, a second electrical insulating member coating a surface of the shield, and an exposed shield portion provided in at least one end portion of the cable with the second electrical insulating member being removed therefrom and the shield being exposed therein during termination. An adhesion strength between the shield and the second electrical insulating member in the exposed shield portion is lower than an adhesion strength between the shield and the second electrical insulating member in an other part of the surface of the shield.

Cable and producing method therefor

A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 &#x3bc;m and 10 &#x3bc;m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

Resin with plating layer and method of manufacturing the same

A linear shape member is composed of a linear shape electrical insulating body comprising irregularities on a surface, and a plating layer coating the surface of the electrical insulating body. An average irregularities spacing Sm of the irregularities is not more than 20.0 &#x3bc;m.

A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an outer surface of the crack suppressing layer. The crack suppressing layer suppresses the occurrence of a cracking in the plating layer by bending while moving in a longitudinal direction of the cable relative to a bending of the insulator.

Signal transmission cable, multicore cable, and method of manufacturing signal transmission cable

A signal transmission cable includes: at least one conductor including at least one wire; a covering layer coating the at least one conductor, the covering layer being made of an insulator; a coating layer coating a periphery of the covering layer; and a plated layer coating the coating layer, the plated layer being made of a material including a metallic material.

A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 &#x3bc;m in a surface layer up to a depth of 50 &#x3bc;m from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using same

A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.

Copper foil and method of manufacturing the same

A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.

Solder joint material and method of manufacturing the same, soldering member and solar cell module

A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.

Copper-based material and method for producing the same

A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100&#xb0; C. and not more than 1320&#xb0; C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.

Dilute copper alloy material and method of manufacturing dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement

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Tokai-mura, Japan

Hideyuki Sagawa