Anden Co., Ltd.

Other

Hideyuki Ohtani

Naoyuki Yasuda

Hideki Kabune

Fukuo Ishikawa

Hiroshi Hattori

Mutuo Taniguchi

An electric connection box includes a resin plate having a connector terminal soldered to a via hole of a circuit substrate. The circuit substrate and the resin plate are inserted to be housed in an opening part of a casing of the electric connection box. A housing is positioned in the opening part and functioning as a cover closing an opening side of the casing. The circuit substrate is supported by the housing and the casing through the resin plate that is held between the housing and the casing while the circuit substrate is spaced from the housing and the casing.

Electrical connection box including a circuit substrate

In a relay module device, a signal converting section transmits driving signals of switching elements when receiving input signals from an external device and sets a relationship between the input signals and the driving signals. The relationship includes a first mode in which the signal converting section transmits the driving signals to separately control one of the switching elements with respect to one of the input signals, and a second mode in which the signal converting section transmits the driving signals to concurrently control two or more of the switching elements with respect to one of the input signals.

Relay module device

In a circuit board of the present invention, a lead frame includes an electrode for mounting an electronic component. The lead frame is encapsulated in a resin portion. The lead frame includes a step portion exposed from a surface of the resin portion so that the electrode is formed. Accordingly, not only lead type electronic components but also surface mount type electronic components can be mounted on the surface of the circuit board. Therefore, because the electronic components can be concentrated, the lead frame circuit board can be miniaturized.

Circuit board with lead frame

Circuit elements of surface-mounting type such as MOSFETs etc. are mounted on a circuit board by soldering. The circuit board is retained slantingly by a base so that any one of the MOSFET falls out by its self-weight when the solder melts due to an abnormal heat generation of the MOSFET. The falling of the MOSFET is stopped by a stopper member, and then the MOSFET becomes in an electrically open state and retained at the stopped position in consequence of the subsequent cooling of the solder. Accordingly, even if one or more of the MOSFETs cause the abnormal heat generation, the continuous heat generation of the MOSFET is stopped and also the other circuit elements are prevented from being short-circuited.

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Nisshin, Japan

Hideyuki Ohtani