Origin Company, Limited

Hideyuki Kokaji

Koji Yamaguchi

Kazuhiro Fukuda

Masaki Sakamoto

To provide a joined member manufacturing apparatus, a method for manufacturing a joined member, and a method for manufacturing a member on which an applied material has been applied, with which it is possible to apply an applied material even in cases where a projection is present in the vicinity of an outer side of an application width of an applied material to be applied on an application target surface. A joined member manufacturing apparatus includes an application device including die headhaving a distance between the ejection port forming groove and an outer edge of the first opposing face at a portion where an ejection port is formed being 0.1 mm to 1.0 mm, a first suction stageA, a second suction stageB, an ultraviolet irradiatorconfigured to radiate an ultraviolet ray, a chamberformed to have a size enabling the chamberto accommodate the first and second suction stagesA andB at the same time, the chamberbeing configured such that a degree of vacuum inside the chamberis adjustable by an operation of a vacuum pump, where the applied material G is configured such that viscosity of the applied material G changes when the applied material G is irradiated with an ultraviolet ray.

Joined member manufacturing apparatus, method for manufacturing joined member, and method for manufacturing member on which applied material has been applied

To prevent misalignment between substrates and distortion of surface, and to keep film thickness uniformity of thin substrate when two substrates are bonded for bonded member, bonded member manufacturing apparatus of bonding first substrate and second substrate, comprising resin film forming means for forming liquid state resin film on the first substrate, semi-curing means for maintaining outer peripheral section of resin film in uncured state and curing inner section surrounded with outer peripheral section in semi-cured state, and substrate bonding means for bonding first substrate and second substrate by bringing second substrate into contact with resin film, such that one end of outer peripheral section is determined as starting point of contact so that boundary line between contact portion and noncontact portion moves in one direction from starting point to opposite end of outer peripheral section while applying pressing force to second substrate.

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Saitama, Japan

Hideyuki Kokaji