Showa Denko Materials Co., Ltd.

Hitachi Chemical Company, Ltd.

Resonac Corporation

Hideyuki Katagi

Yoshitaka Takezawa

Naoki Maruyama

Yuki Nakamura

Kazumasa Fukuda

Tomoko Higashiuchi

Kenji Tanaka

Haruaki Sue

Shinichi Kosugi

Yuka Yoshida

Tomoo Nishiyama

Lin Tian

Tomohiro Ikeda

Kazuhiko Kurafuchi

Atsushi Kuwano

Shingo Tanaka

Toshizumi Yoshino

Toshiaki Shirasaka

Naoki Hara

Kazuya Kiguchi

Yoshihiro Amano

Kensuke Yoshihara

Masaya Ookawa

Yoshiaki Fuse

Kei Tougasaki

An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material

An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa·mor more, and a glass transition temperature of 150° C. or higher.

An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each Rindependently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. 

Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing

An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of &#x3b7;'2/&#x3b7;&#x2032;1 equal to 3 or less, wherein &#x3b7;&#x2032;1 is an initial dynamic shear viscosity (Pa&#xb7;s) and &#x3b7;&#x2032;2 is a maximum value of dynamic shear viscosity (Pa&#xb7;s), in a measurement of dynamic shear viscosity.

An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound

A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Resin sheet and cured product of resin sheet

The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Rto Rindependently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent. 

Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product

Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole. 

Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 &#x3bc;m to less than 1 &#x3bc;m, from 1 &#x3bc;m to less than 10 &#x3bc;m, and from 10 &#x3bc;m to 100 &#x3bc;m, and the filler contains boron nitride particles having particle sizes of from 10 &#x3bc;m to 100 &#x3bc;m. In the general Formula (I), Rrepresents an alkyl group, an aryl group, or an aralkyl group. Each of Rand Rindependently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.

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Tokyo, Japan

Hideyuki Katagi