Fuji Xerox Co., Ltd.

Suzuka Fuji Xerox Co., Ltd.

Hideyuki Ikoma

Michiaki Murata

Tsutomu Otsuka

Kenichi Ono

Takahiro Hashimoto

Hiromu Ono

Setsuo Suzuki

Takeyoshi Horiuchi

Takashi Toyoda

Shogo Komagata

Sayuri Natsui

Shunsuke Ueda

Takao Takagi

A method for producing a semiconductor piece includes forming a first groove portion of a front-surface-side groove by anisotropic dry etching from a front surface of a substrate, forming a second groove portion of the front-surface-side groove, the second groove portion being located below and in communication with the first groove portion and having a width wider than a width of the first groove portion, and thinning the substrate from a back surface of the substrate up to the second groove portion. The second groove portion is formed by changing an etching condition of the anisotropic dry etching during the formation of the front-surface-side groove so that the width of the second groove portion is wider than the width of the first groove portion.

Method for producing semiconductor piece, circuit board and electronic device including semiconductor piece, and method for designing etching condition

A method for manufacturing a semiconductor chip includes forming at least a portion of a front-side groove by anisotropic dry etching from a front surface of a substrate along a cutting region; forming a modified region in the substrate along the cutting region by irradiating the inside of the substrate with a laser along the cutting region; and dividing the substrate along the cutting region by applying stress to the substrate.

Method for manufacturing semiconductor chip that includes dividing substrate by etching groove along cutting region of substrate combined with forming modified region by laser irradiating along cutting region in substrate

An LED print head is arranged opposite to a photosensitive body, consisting of a base body, which is arranged parallel to the axis of the photosensitive body and consists of a large volume base part having an upper face opposite to the photosensitive body and a small volume projection part extending upward from a part of the upper face of the base part, and having a narrow width in the path of the photosensitive body. An LED base panel is fitted on the upper face of the base part, and a lens array is on the part of a side of the projecting part, being arranged between the opposing face of the photosensitive body, and the upper face of the LED base panel. Manufacturing and attaching methods relating to the print head are also disclosed.

LED print head and production method of LED print head and method of producing LED substrate and method of pasting LED substrate

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Kanagawa, Japan

Hideyuki Ikoma