Dowa Electronics Materials Co., Ltd.

Hideyuki Fujimoto

Kenichi Inoue

Masahiro Yoshida

Keiichi Endoh

Satoru Kurita

Atsushi Ebara

Kozo Ogi

Akihiro Asano

Minami Kanasugi

In a bonding material of a metal paste containing metal particles, a solvent and a dispersant, the metal particles containing first metal particles having an average primary particle diameter of 1 to 40 nm, second metal particles having an average primary particle diameter of 41 to 110 nm, and third metal particles having an average primary particle diameter of 120 nm to 10 μm, the weight percentages of the first, second and third metal particles being 1.4 to 49% by weight, 36% by weight or less, and 50 to 95% by weight, respectively, with respect to the total 100% by weight of the metal particles, and the weight ratio of the first metal particles to the second metal particles being 14/36 or more.

Bonding material and bonding method using same

To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 &#x3bc;m to 10 &#x3bc;m, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

Silver-bismuth powder, conductive paste and conductive film

Growing community of inventors

Tokyo, Japan

Hideyuki Fujimoto