Ngk Insulators, Inc.

Other

Applied Materials, Inc.

Hideyoshi Tsuruta

Yoshinobu Goto

Tomoyuki Fujii

Ryusuke Ushikoshi

Yasufumi Aihara

Tetsuya Kawajiri

Kazuaki Yamaguchi

Ikuhisa Morioka

Nobuyuki Kondou

Christopher F Lane

David Wingto Cheung

Yuji Katsuda

Naohito Yamada

Mark A Fodor

Keiji Kawasaki

Satoru Yamada

Naoki Miyazaki

Yasumitsu Tomita

Masahito Eguchi

Kazuma Ohba

Takuya Yanoh

Kiyoshi Nashimoto

A wafer holderincludes a resin adhesive layerbetween a ceramic electrostatic chuckand a metal cooling plate. The adhesive layerincludes a first layerin contact with the electrostatic chuck, a second layerin contact with the cooling plate, and an intermediate layerlocated between the first layerand the second layer. Heat resistance of each of the first layerand the intermediate layeris higher than heat resistance of the second layer, flexibility of the second layeris higher than flexibility of each of the first layerand the intermediate layer, and the layers are in hermetic contact with each other.

Wafer holder and method for manufacturing the same

A heating device has a ceramic base with a heating surface, and a heating body embedded in the ceramic base. The heating device includes a thermal conductive member positioned between the heating surface and the heating body in the ceramic base. The thermal conductive member has a thermal conductivity that is higher than the ceramic base and as such, the heating device achieves superior temperature uniformity of a heated object particularly in a semiconductor device manufacturing process.

Heating device

The power-supplying member comprises: a first rod-shaped member connected to at least one of a heating resistor and an electrode; a second rod-shaped member connected to a power supply; and a thermal-function member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which has a smaller axial cross section area and a larger surface area as compared to the first and second rod-shaped members.

Power-supplying member and heating apparatus using the same

A plasma processing member includes a ceramic base, a plasma generating electrode embedded in the ceramic base, and an electrode power supply member connected to the plasma generating electrode. The impedance of the plasma processing member when plasma is generated using high frequency power at a frequency higher than 13.56 MHz is adjusted to 25&#x3a9; or less.

Plasma processing member

An electrostatic chuck includes a ceramic base having an electrode embedded in vicinity to a holding face for holding a substrate. On a back side of this ceramic base, provided are a terminal connected to the electrode, a wafer temperature control member, and an insulating member for insulating the temperature control member from the terminal. This insulating member has a flange portion on its end portion in contact with the ceramic base, and is made of highly thermal conductive ceramics.

Electrostatic chuck

A power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-expansion absorbing member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which shrinks in a longitudinal direction in response to changes in shape of the first rod-shaped member and the second rod-shaped member in the longitudinal direction due to thermal expansion.

An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.

A substrate heating apparatus is provided, including a base group including a plurality of bases, which are arranged substantially into a plate with a gap interposed between the bases, and which form a substrate mounting surface. A resistance heating element provided for at least one of the bases.

Substrate heating apparatus

A substrate heating apparatus includes a ceramic base having a concave heating surface on which a substrate is placed, and a resistance heating element buried in the ceramic base. The central part of the concave heating surface defines the lowest point of the heating surface and the peripheral part of the concave heating surface defines the highest point of the heating surface.

Substrate heating apparatus and manufacturing method for the same

The present invention provides members that are provided around a susceptor for mounting a semiconductor in a chamber for a semiconductor production system. Each member has a function of independently generating heat to heat the semiconductor, at least by radiation, and preferably, a heat generating element is embedded in each member.

Systems for producing semiconductors and members therefor

A substrate heating device is provided, including a ceramic base plate having a heating surface on which a substrate is placed, resistance heating elements buried in the ceramic base plate corresponding to a plurality of zones into which the heating surface is divided, terminals respectively connected to the resistance heating elements, and lead wires respectively connected to the terminals and wired on an outer surface of the ceramic base plate other than the heating surface.

Substrate heating device

A member provided around a susceptor for mounting a semiconductor in a chamber of a semiconductor production system. The member has a face opposing the susceptor and a center line average surface roughness of the face opposing the susceptor is 0.5 &#x3bc;m or less. Alternatively, the face opposing the susceptor has a thermal emissivity &#x3b5; of 0.5 or lower. The member can also be a liner [] having a supported face [] whose area is not more than 20 percent of that of the face [] opposing the susceptor.

An object of the present invention is to provide a heating system having a ceramic heater and a supporting member supporting the back face of the heater, so that the cost of the supporting member can be reduced, the design change of the heater is made easier and excellent flatness of the heating face on use can be maintained. The heating system has a ceramic substratehaving a heating faceand a back face, a heating meansfor generating heat from the heating faceof the substrate, a metal supporting membersupporting the back faceof the substrate, and a heat insulating plateprovided between the back faceof the substrateand the supporting member

Heating systems

A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are joined with each other via a metal adhesive. The metal adhesive contains at least indium and at least one material containing at least a component capable of reducing the melting point of indium and is provided between the first and second members to provide a laminate. The laminate is heated at a temperature in a solid-liquid coexisting range of an alloy comprising indium and the indium melting point reducing component to join the first and second members.

Joined bodies and a method of producing the same

A substrate heater is provided including a plate-shaped ceramic base having a first side defining a convex heating surface on at least a portion of which a substrate is placed, a resistance-heating element embedded in the ceramic base, and a tubular member joined to a central portion on an opposed second side of the ceramic base. The convex heating surface has a central portion and a peripheral portion, wherein the height of the heating surface decreases from the central portion toward the peripheral portion thereof.

Growing community of inventors

Tokai, Japan

Hideyoshi Tsuruta