Matsushita Electric Works, Ltd.

Panasonic Electric Works Co., Ltd.

Panasonic Corporation

Hideyoshi Kimura

Masaru Sugimoto

Eiji Shiohama

Takuma Hashimoto

Ryoji Yokotani

Toshiyuki Suzuki

Yutaka Iwahori

Satoshi Mori

Mitsuru Kobayashi

Koji Nishioka

Kazuya Nakagawa

Shinya Ishizaki

Masao Yamaguchi

Tadashi Murakami

Yoshiyuki Uchinono

Jiro Hashizume

Masahide Muto

Hiroyuki Sekii

Takuma Hashmoto

Kouji Nishioka

Itukou Kuzuhara

Sigenari Takami

A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit light of a wavelength different from an excitation wavelength; and an emission control member disposed at a light output side of the wavelength converting member so as to allow emission of light coming from an area of the wavelength converting member that corresponds to the recess and to prevent emission of light coming from an area of the wavelength converting member that corresponds to the edge area around the recess. This can prevent variations in color between light emitted from the central part of the wavelength converting member and light emitted from the part of the wavelength converting member that is located on the edge area around the recess of the mounting substrate, thereby reducing unevenness of color on the irradiation surface.

Light emitting device using light emitting diode chip

A light-emitting device () has a submount () and a plate for heat transfer () having a metallic plate (). The submount () has a mount base (), at least one light-emitting diode chip () mounted thereon and electrically conducting lines (-) formed on the mount base () to be connected electrically to the light-emitting diode chip (). A first plane () of the mount base () of the submount () is bonded thermally to the first plate (). For example, the plate is a circuit board having a metallic plate (), and the submount () is bonded thermally to the metallic plate () of the one of the at least one plate (). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base () for providing a plurality of heat transfer paths.

Light-emitting device

A light-emitting device which uses and LED having a light-emitting element being placed on a package substrate. The light-emitting element has a light-extracting surface. A fluorescent element which is formed by dispersing a fluorescent material in a transparent substance and is placed face to face with the light-extracting surface of the light emitting element and comprises a clearance gap in between. The light-emitting element generates light of a certain wavelength that emanates through the light-extracting surface into the fluorescent element where the wavelength is changed. The device further comprises an optical element which receives light from the light-emitting element through the fluorescent element and directs the light to the outside of the device.

Light emitting device using LED

A light emitting device that can provide enhanced heat radiation as well as allowing light from a light emitting diode (LED) chip to be efficiently extracted out of the device. This light emitting device includes a metal plate () that is made of aluminum. The metal plate () has a projection () projecting forward. The projection () has a front side provided with a housing recess (). An LED chip () is mounted on the bottom of the housing recess () so that it is thermally coupled to the metal plate (), thus allowing heat to be radiated efficiently. A printed circuit board (), having a grass epoxy substrate to be joined to the front surface of the metal plate (), is provided with an insertion hole () into which the projection () is inserted. The LED chip () and a bonding wire (W) are encapsulated in a transparent resin seal portion (). The side wall of the housing recess () that is part of the metal plate () functions as a reflector for reflecting forward light emitted from the LED chip (). Thus, light from the LED chip () can be extracted efficiently.

A light source apparatus having a radiator plate having thermally conductive properties and an insulating member coupled to at least one side of the radiator plate having a through hole provided in a side thereof facing the radiator plate. The light source apparatus further including a LED chip installed and thermally coupled to an exposed portion of the radiator plate facing the through hole, an extension inwardly projecting at the through hole from the radiator plate end of the insulating member, and a wiring pattern provided on the insulating member electrically isolated by the insulating member from the radiator plate. The light source apparatus also including bonding wires electrically connecting portions of the wiring pattern on the extension and the electrodes of the LED chip, and a light-transmissive sealing material filling the through hole for entirely encapsulating the LED chip and the bonding wires.

Light source device using LED, and method of producing same

A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.

Method of manufacturing printed wiring board

Growing community of inventors

Hirakata, Japan

Hideyoshi Kimura