Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hideyo Suzuki

Fusanori Nishikimi

Kinya Nakatsu

Takeshi Matsuo

Toshiya Satou

Kenichiro Nakajima

Haruki Hamada

Masashi Kosuga

Atsushi Yukita

Keisuke Horiuchi

Koichi Yahata

Youhei Nishizawa

Hideki Homma

The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Power conversion apparatus and electric vehicle

In a power conversion device according to the present invention, a capacitor module, includes a first capacitor element; a second capacitor element; a positive pole-side bus bar; and a negative pole-side bus bar disposed in a laminated state, in which the positive pole-side bus bar and the negative pole-side bus bar are laminated via an insulating member. The first capacitor element includes a first body portion, a first positive pole-side electrode, and a first negative pole-side electrode. The second capacitor element includes a second body portion, a second positive pole-side electrode, and a second negative pole-side electrode. The first capacitor element is disposed so that the first positive pole-side electrode assumes a position closer to the second negative pole-side electrode than to the second positive pole-side electrode and faces the second negative pole-side electrode; and a laminate portion formed with the positive pole-side bus bar and the negative pole-side bus bar continues up to a point over a space where the first positive pole-side electrode and the second negative pole-side electrode face each other.

Capacitor module and power conversion device

An object of the present invention is to reduce the size of a power conversion apparatus and to improve the reliability. The power conversion apparatus includes a power semiconductor module, a driver circuit board mounted with a driver circuit, an AC-side relay conductor for transferring the alternating current, and an AC connector. The power semiconductor module includes an AC-side terminal connected to the AC-side relay conductor, and a control-side terminal connected to the driver circuit board. The AC connector is provided on the opposite side of the power semiconductor module through the driver circuit board. The driver circuit board includes a transformer for transforming voltage from low to high and supplying the transformed voltage to the driver circuit, and a line for connecting the transformer and the driver circuit. Further, the driver circuit board forms a through hold provided on the side opposite to the transformer with the driver circuit interposed therebetween. The AC-side relay conductor is connected to the AC-side connector, through the through hole.

Power conversion apparatus

An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows. The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part. The first flow path part is formed at a position facing the side wall that forms the housing space. The power semiconductor module is inserted into the first flow path part.

A power converter is provided to improve connection reliability of internal components of the power converter. The power converter may include a power semiconductor module that converts DC current into AC current, a casing that forms a housing space for housing the power semiconductor module, an AC relay bus bar that is connected to an AC terminal of the power semiconductor module by weld connection, and an AC terminal block that is connected to an AC terminal of a motor. The AC relay bus bar may be supported by the casing through an insulating member, and the AC terminal block may be connected to the AC relay bus bar and supported by the casing.

Power converter

A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Reduced size power inverter suitable for a vehicle

An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows . The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part . The first flow path part is formed at a position facing the side wall that forms the housing space. The power semiconductor module is inserted into the first flow path part.

Growing community of inventors

Hitachinaka, Japan

Hideyo Suzuki