Fuji Machine Mfg. Co., Ltd.

Fuji Corporation

Hideyasu Takamiya

Yukinori Nakayama

Shinji Naito

Yasuhiko Ota

A system includes feeder storage that stores feeders to be replenished to multiple component mounters and feeders removed from each component mounter, automatic exchanging device to replenish a feeder taken from the feeder storage to each component mounter and collect a feeder removed from each component mounter to the feeder storage, and feeder management section that manages whether each feeder stored in the feeder storage is a feeder to be replenished or a feeder to be collected. State display section, being provided with each feeder on an end face part on a removal direction side or an upper end face part, is configured to display a state of the feeder, and the feeder management section displays whether each feeder stored in the feeder storage is the feeder to be replenished or the feeder to be collected, on the state display section of each feeder.

Feeder state display system

A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.

Die supply apparatus

A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism. An order of an operation for inverting the wafer component and mounting the wafer component on the circuit substrate and an operation for mounting the feeder component on the circuit substrate is set so that the supply head and the mounting head do not interfere with each other; and an operation for moving down the supply head and the stage, allowing the wafer component to be sucked by the supply head, and inverting the wafer component is performed so as to overlap with an operation for sucking and mounting the feeder component by the mounting head.

Growing community of inventors

Chiryu, Japan

Hideyasu Takamiya