Showa Denko K.k.

Kabushiki Kaisha Toyota Jidoshokki

Hideyasu Obara

Shogo Mori

Shinobu Tamura

Taizo Kuribayashi

Keiji Toh

Shinobu Yamauchi

Shintaro Nakagawa

Nobuhiro Wakabayashi

A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet, and an outflow pipe connected to the cooling-liquid outlet. The casing includes a cooling-liquid outflow portion, and the cooling-liquid outlet is formed in a top wall of the cooling-liquid outflow portion. The outflow pipe has a bottom wall parallel to a portion of the top wall of the cooling-liquid outflow portion where the cooling-liquid outlet is formed. The bottom wall has a through hole for communication with the cooling-liquid outlet. A guide portion is provided on a portion of an upper surface of a bottom wall of the cooling-liquid outflow portion, the portion corresponding to the cooling-liquid outlet, so as to change, toward an upward direction, the flow direction of cooling liquid flowing into the cooling-liquid outflow portion. Thus, a flow resistance which cooling liquid undergoes when flowing out of the casing can be reduced.

Liquid-cooled-type cooling device

A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.

A casing of a liquid-cooled-type cooling device has a peripheral wall including mutually facing right and left side walls. A cooling-liquid inlet is formed at one end of the right side wall, and a cooling-liquid outlet is formed at an end of the left side wall corresponding to the other end of the right side wall. A parallel-flow-channel section is provided within the casing to be located between the left and right side walls and between the cooling-liquid inlet and outlet and includes flow channels through which cooling liquid flows. Internal regions of the casing located upstream and downstream of the parallel-flow-channel section serve as inlet and outlet header sections, respectively. The cross-sectional area of the inlet header section reduces from the cooling-liquid inlet toward the left side wall. The outlet and inlet header sections are asymmetric in shape with respect to the width direction of the parallel-flow-channel section.

A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet. A fin for forming flow channels is disposed within the casing between the inlet and the outlet. A portion of the interior of the casing located rearward of the fin is an inlet header section, and a portion of the interior of the casing located frontward of the fin is an outlet header section. A rear side surface within the inlet header section is skewed toward the fin in a direction from the right side toward the left side. A positioning vertical surface extending straight along the left-right direction and positioning a rear end portion of the fin is provided on a lower portion of a left end portion of the rear side surface within the inlet header section. The rear end portion of the fin is in contact with the positioning vertical surface.

A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

Base for power module

A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

Growing community of inventors

Kariya, Japan

Hideyasu Obara